Patent Assignment
Reel/Frame 020143/0178
Security Agreement
Recorded: 2007-11-21
Received: 2007-11-21
Pages: 20
Assignor
GLOBAL MARKET
Executed: 2007-11-19
Assignee
WACHOVIA BANK, NATIONAL ASSOCIATION
1133 AVENUE OF THE AMERICAS, NEW YORK, NY, 10169, UNITED STATES
Covered Properties
(22)
Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same
Application:
60/979,064 →
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Application:
11/593,949 →
Laser ablation resistant copper foil
Application:
11/592,943 →
Copper alloy containing cobalt, nickel and silicon
Application:
11/588,111 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
11/246,966 →
Support Layer for Thin Copper Foil
Application:
10/965,347 →
Fretting and Whisker Resistant Coating System and Method
Application:
10/962,917 →
Tarnish Deterring Tin Coating
Application:
10/930,316 →
Silver containing copper alloy
Application:
10/782,019 →
Peel Strength Enhancement of Copper Laminates
Application:
10/727,920 →
Age-hardening copper-base alloy and processing
Application:
10/657,005 →
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Application:
10/653,582 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
10/610,433 →
Bond Enhancement Antitarnish Coatings
Application:
10/017,863 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/948,166 →
Silver Containing Copper Alloy
Application:
09/923,137 →
Water-Based Adhesive
Application:
09/907,224 →
Copper Alloy Having Improved Stress Relaxation Resistance
Application:
09/879,616 →
Copper Foil Composite Including a Release Layer
Application:
09/842,454 →
Process for Making Copper-Tin-Zinc Alloys
Application:
09/808,337 →
Copper Alloy
Application:
09/800,989 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/784,547 →