Copper alloy containing cobalt, nickel and silicon
View Patent ↗A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.
1. A wrought copper alloy consisting essentially, by weight, of: from 1% to 2.5% of nickel; from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3% and a weight percent ratio of nickel to cobalt that is from 0.5:1 to 5:1; from 0.5% to 1.5% of silicon with the weight ratio of (Ni+Co)/Si being between 3.5:1 and 6:1; and the balance copper and inevitable impurities wherein said wrought copper alloy has an electrical conductivity in excess of 40% IACS, a yield strength in excess of 95 ksi, a minimum bend radius as a function of thickness, mbr/t of up to 4t for both good way and bad way bends and an average grain size of 20 microns or less following solutionizing at 950° C.
2. The wrought copper alloy of claim 1 wherein said nickel content is from 1.3% to 1.9%, said cobalt content is from 0.5% to 1.5% and said silicon content is from 0.5% to 0.8%.
3. The wrought copper alloy of claim 2 wherein a weight percent ratio of nickel to cobalt is from 1.01:1 to 1.5:1.
4. The wrought copper alloy of claim 3 wherein said wrought copper alloy has a yield strength of 100 ksi or greater.
5. A wrought copper alloy consisting essentially, by weight, of: from 1% to 2.5% of nickel; from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3% and a weight percent ratio of nickel to cobalt that is from 1.01:1 to 2.6:1; from 0.5% to 1.5% of silicon with the weight ratio of (Ni+Co)/Si being between 3.5:1 and 6:1; from an amount effective to improve a combination of yield strength and electrical conductivity up to 1.0% of silver, titanium, zirconium and combinations thereof; up to 0.15% of magnesium; and the balance copper and inevitable impurities wherein said wrought copper alloy has an electrical conductivity in excess of 40% IACS, a minimum bend radius as a function of thickness, mbr/t of up to 4 t for both good way and bad way bends and an average grain size of 20 microns or less following solutionizing at 950° C.
6. The wrought copper alloy of claim 5 wherein said silver content is from 0.2% to 0.7%.
7. The wrought copper alloy of claim 6 wherein the magnesium content is between 0.005% and 0.04%.
8. The wrought copper alloy of claim 5 wherein said nickel content is from 1.3% to 1.9%, said cobalt content is from 0.5% to 1.5% and said silicon content is from 0.5% to 0.8%.
9. The wrought copper alloy of claim 8 wherein a weight percent ratio of nickel to cobalt is from 1.01:1 to 1.5:1.
10. The wrought copper alloy of claim 9 wherein said wrought copper alloy has a yield strength of 100 ksi or greater.