IP Library › Assignment 024990/0283
Patent Assignment
Reel/Frame 024990/0283

Amendment No. 1 Patent Agreement, to Patent Agreement Recorded on 11/27/01, Reel 20156, Frame 0265.

Recorded: 2010-09-16 Received: 2010-09-16 Pages: 27
Assignor
GBC METALS, LLC
Executed: 2010-08-18
Assignee
WELLS FARGO BANK, NATIONAL ASSOCIATION
12 EAST 49TH STREET, NEW YORK, NY, 10017, UNITED STATES
Covered Properties (26)
Support Layer for Thin Copper Foil
Application: 12/796,520 →
Antitarnish, Antimicrobial Copper Alloys and Surfaces Made from Such Alloys
Application: 61/259,837 →
Copper-Nickel-Silicon Alloys
Copper Tin Nickel Phosphorus Alloys with Improved Strength and Formality and Method of Making Same
Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same
Application: 12/249,530 →
Fretting and Whisker Resistant Coating System and Method
Application: 12/145,420 →
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Application: 11/593,949 →
Copper alloy containing cobalt, nickel and silicon
Application: 11/588,111 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application: 11/246,966 →
Support Layer for Thin Copper Foil
Fretting and Whisker Resistant Coating System and Method
Application: 10/962,917 →
Tarnish Deterring Tin Coating
Application: 10/930,316 →
Laser Ablation Resistant Copper Foil
Peel Strength Enhancement of Copper Laminates
Application: 10/727,920 →
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Application: 10/653,582 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application: 10/610,433 →
Bond Enhancement Antitarnish Coatings
Application: 10/017,863 →
Copper Foil with Low Profile Bond Enhancement
Application: 09/948,166 →
Silver Containing Copper Alloy
Application: 09/923,137 →
Water-Based Adhesive
Application: 09/907,224 →
Copper Alloy Having Improved Stress Relaxation Resistance
Application: 09/879,616 →
Cable Crossover Exercise Apparatus
Application: 09/864,246 →
Copper Foil Composite Including a Release Layer
Application: 09/842,454 →
Process for Making Copper-Tin-Zinc Alloys
Application: 09/808,337 →
Copper Alloy
Application: 09/800,989 →
Copper Foil with Low Profile Bond Enhancement
Application: 09/784,547 →