Patent Assignment
Reel/Frame 020156/0265
Corrective Assignment to Correct the Conveying Party Name from Global Market, Llc to Global Metals, Llc Previously Recorded on Reel 020143 Frame 0178. Assignor(S) Hereby Confirms the Security Agreement.
Recorded: 2007-11-27
Received: 2007-11-27
Pages: 24
Assignor
GLOBAL METALS, LLC
Executed: 2007-11-19
Assignee
WACHOVIA BANK, NATIONAL ASSOCIATION
1133 AVENUE OF THE AMERICAS, NEW YORK, NY, 10036, UNITED STATES
Covered Properties
(27)
Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same
Application:
60/979,064 →
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Application:
11/593,949 →
Laser ablation resistant copper foil
Application:
11/592,943 →
Copper alloy containing cobalt, nickel and silicon
Application:
11/588,111 →
Systems and Methods for Monitoring a Process Output with a Highly Abridged Spectrophotometer
Application:
11/397,547 →
Dual Illumination Angle Goniometric Spectrophotometer
Application:
11/266,573 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
11/246,966 →
Method for Operating a Color Measurement System
Application:
11/119,867 →
Color Measurement Instrument Capable of Both Strip Reading and Spot Reading
Application:
11/116,866 →
Support Layer for Thin Copper Foil
Application:
10/965,347 →
Fretting and Whisker Resistant Coating System and Method
Application:
10/962,917 →
Tarnish Deterring Tin Coating
Application:
10/930,316 →
Silver containing copper alloy
Application:
10/782,019 →
Scanner and Printer Profiling System
Application:
10/743,175 →
Peel Strength Enhancement of Copper Laminates
Application:
10/727,920 →
Age-hardening copper-base alloy and processing
Application:
10/657,005 →
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Application:
10/653,582 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
10/610,433 →
Bond Enhancement Antitarnish Coatings
Application:
10/017,863 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/948,166 →
Silver Containing Copper Alloy
Application:
09/923,137 →
Water-Based Adhesive
Application:
09/907,224 →
Copper Alloy Having Improved Stress Relaxation Resistance
Application:
09/879,616 →
Copper Foil Composite Including a Release Layer
Application:
09/842,454 →
Process for Making Copper-Tin-Zinc Alloys
Application:
09/808,337 →
Copper Alloy
Application:
09/800,989 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/784,547 →