Patent Application
Utility
App. No. 09/950,759
· Confirmation No. 2288
Semiconductor fabrication device and method for preventing the attachment of extraneous particles
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-09-13 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-09-13 | SPEC |
Specification | 41 | View | |
| 2001-09-13 | CLM |
Claims | 7 | View | |
| 2001-09-13 | ABST |
Abstract | 1 | View | |
| 2001-09-13 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2001-09-13 | OATH |
Oath or Declaration filed | 2 | View | |
| 2001-09-13 | LET. |
Miscellaneous Incoming Letter | 1 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
118/715
H10P72/0434
H10P50/242
H01J2237/2001
Prosecution
- Examiner
- MOORE, KARLA A
- Art Unit
- 1763
- Docket No.
- Q66168
- Confirmation No.
- 2288
Foreign Priority
2000-290632
·
2000-09-25
·
JAPAN
Publication
- Pub. No.
- US20020036343A1
- Pub. Date
- 2002-03-28
No related applications found.
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-25
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-09-13
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Quick Facts
- App. No.
- 09/950,759
- Filed
- 2001-09-13
- Pub. No.
- US20020036343A1
- Examiner
- MOORE, KARLA A
- Art Unit
- 1763
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