Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
View Patent ↗Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.
1. A curable silicone adhesive composition comprising in combination:
A. a curable polymeric base material comprising a curable silicone composition;
B. contained in said polymeric base material:
(i) inorganic insulating particles having mixed various sizes and having an average size of less than 10 μm, and,
(ii) organic insulator particles having average particle sizes of 1 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, said organic insulator particles being present in the composition in an amount of 0.16 to 0.69% by weight of the curable adhesive composition.
2. A curable adhesive composition as claimed in claim 1 wherein the organic insulator particles are divinylbenzene crosslinked polystyrene.
3. A semiconductor device in which at least two individual substrates are joined and bonded by an adhesive composition as claimed in claim 1 .
4. The semiconductor device as claimed in claim 3 wherein the two individual substrates are a semiconductor die and an attachment substrate for the semiconductor die.
5. A process for joining at least two individual substrates, said process comprising:
(I) applying an adhesive composition as claimed in claim 1 to at least one surface of at least one of the individual substrates;
(II) mounting another individual substrate to the adhesive treated side of the substrate of (I) to form a laminate thereof;
(III) applying pressure to the laminate to disperse the adhesive therebetween until each of the substrates contact the largest organic insulator particles of the adhesive composition, and thereafter,
(IV) curing the adhesive composition.
6. The process as claimed in claim 5 wherein additionally, heat is applied in step (III).
7. The process as claimed in claim 5 wherein the two individual substrates are a semiconductor die and an attachment substrate for the semiconductor die.
8. An adhesive composition as claimed in claim 1 , wherein the curable silicone composition has a cure mechanism selected from the group consisting of:
(ii) condensation reactions;
(iii) addition reactions;
(iv) ultraviolet initiated radiation reactions, and,
(v) free radical initiated reactions.
9. An adhesive composition as claimed in claim 1 wherein the silicone composition is an addition reaction curable silicone composition.
10. A curable adhesive composition as claimed in claim 1 wherein the organic insulator particles are divinylbenzene crosslinked polystyrene.
11. A semiconductor device in which at least two individual substrates are joined and bonded by an adhesive composition as claimed in claim 1 .
12. The semiconductor device as claimed in claim 11 wherein the two individual substrates are a semiconductor die and an attachment substrate for the semiconductor die.
13. A process for joining at least two individual substrates, said process comprising:
(I) applying an adhesive composition as claimed in claim 1 to at least one surface of at least one of the individual substrates;
(II) mounting another individual substrate to the adhesive treated side of the substrate of (I) to form a laminate thereof;
(III) applying pressure to the laminate to disperse the adhesive therebetween until each of the substrates contact the largest organic insulator particles of the adhesive composition, and thereafter,
(IV) curing the adhesive composition.
14. The process as claimed in claim 13 wherein additionally, heat is applied in step (III).
15. The process as claimed in claim 13 wherein the two individual substrates are a semiconductor die and an attachment substrate for the semiconductor die.
16. An adhesive composition as claimed in claim 1 , wherein the curable silicone composition has a cure mechanism selected from the group consisting of:
(ii) condensation reactions;
(iii) addition reactions;
(iv) ultraviolet initiated radiation reactions, and,
(v) free radical initiated reactions.
17. An adhesive composition as claimed in claim 1 wherein the silicone composition is an addition reaction curable silicone composition.
18. A curable adhesive composition comprising in combination:
a curable silicone polymeric base material and contained in said silicone polymeric base material, organic insulator particles having average particle size of 1 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, said organic insulator particles being present in the composition in an amount sufficient to provide a planar adhesive bond thickness between substrates being joined by said adhesive.