Patent Application
Utility
App. No. 09/961,069
· Confirmation No. 6724
MULTILAYER INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR DEVICE
Inventor:
Eiichi Umemura
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-12-22 | IFEE |
Issue Fee Payment (PTO-85B) | 2 | View | |
| 2001-09-24 | TRNA |
Transmittal of New Application | 4 | View | |
| 2001-09-24 | SPEC |
Specification | 18 | View | |
| 2001-09-24 | CLM |
Claims | 5 | View | |
| 2001-09-24 | ABST |
Abstract | 1 | View | |
| 2001-09-24 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2001-09-24 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Eiichi Umemura
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/758
H10W20/425
H10P14/412
H10W20/033
H10W20/4407
H10W20/036
H10W20/064
Prosecution
- Examiner
- WARREN, MATTHEW E
- Art Unit
- 2817
- Docket No.
- OKI.078D
- Confirmation No.
- 6724
Foreign Priority
284058/98
·
1998-10-06
·
JAPAN
Publication
- Pub. No.
- US20020014698A1
- Pub. Date
- 2002-02-07
Patent Term Adjustment
-92days
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Quick Facts
- App. No.
- 09/961,069
- Filed
- 2001-09-24
- Granted
- 2004-02-10
- Pub. No.
- US20020014698A1
- Examiner
- WARREN, MATTHEW E
- Art Unit
- 2817
- PTA
- -92 days
External Links