Patent Assignment
Reel/Frame 022343/0290
Change of Name
Recorded: 2009-02-26
Received: 2009-03-03
Pages: 14
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Properties
(65)
Transfer Molding Apparatus and Method for Manufacturing Semiconductor Device
Application:
11/771,057 →
Method of Testing Circuit Elements on a Semiconductor Wafer
Application:
11/785,644 →
Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same
Application:
11/736,408 →
Semiconductor device and method of fabricating the same
Application:
11/500,951 →
Manufacturing Method Which Prevents Abnormal Gate Oxidation
Application:
11/367,435 →
Semiconductor Device
Application:
11/010,315 →
Semiconductor Device
Application:
11/010,339 →
Transfer Molding Apparatus and Method for Manufacturing Semiconductor Devices
Application:
10/890,222 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/862,331 →
Semiconductor device and manufacturing method thereof
Application:
10/800,693 →
Module Circuit Board for Semiconductor Device Having Barriers to Isolate I/O Terminals from Solder
Application:
10/775,232 →
Transposition Circuit
Application:
10/766,484 →
Manufacturing Method Which Prevents Abnormal Gate Oxidation
Application:
10/737,821 →
Method and Systme for Managing Semiconductor Manufacturing Equipment
Application:
10/712,100 →
Method of Forming a Ball Grid Array Package
Application:
10/712,054 →
Semiconductor Package with a Chip Connected to a Wiring Substrate Using Bump Electrodes and Underfilled with Sealing Resin
Application:
10/631,741 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/615,824 →
Semiconductor Device Having a Dummy Active Region for Controlling High Density Plasma Chemical Vapor Deposition
Application:
10/614,781 →
Drive Circuit and Display Unit for Driving a Display Device and Portable Equipment
Application:
10/444,983 →
Method of Dividing a Semiconductor Wafer
Application:
10/431,816 →
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections
Application:
10/397,369 →
Electronic Device
Application:
10/331,767 →
Input Protection Circuit Connected to Protection Circuit Power Source Potential Line
Application:
10/323,912 →
Method for Forming an Interconnection in a Semiconductor Element
Application:
10/320,582 →
Method for Fabricating Semiconductor Apparatus Using Board Frame
Application:
10/317,152 →
Method of Fabricating a Semiconductor Device
Application:
10/310,774 →
Module Circuit Board for Semiconductor Device Having Barriers to Isolate I/O Terminals from Solder
Application:
10/289,358 →
Method for Manufacturing and Testing Semiconductor Devices on a Resin-Coated Wafer
Application:
10/279,988 →
Method of Fabricating an Encapsulated Semiconductor Device with Partly Exposed Leads
Application:
10/262,062 →
Advanced Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/246,840 →
Semiconductor Integrated Circuit and Testing Method Thereof
Application:
10/218,617 →
Method of Manufacturing Semiconductor Capacitor
Application:
10/212,878 →
Semiconductor Device
Application:
10/207,191 →
Method and System for Managing Semiconductor Manufacturing Equipment
Application:
10/206,067 →
Resist Mask for Measuring the Accuracy of Overlaid Layers
Application:
10/196,379 →
Resist Mask for Measuring the Accuracy of Overlaid Layers
Application:
10/196,413 →
Method of Transferring a Material from First Apparatus to Second Apparatus in the Clean Room and an Assembly Line
Application:
10/132,185 →
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections
Application:
10/127,599 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/125,427 →
Method of Manufacturing a Semiconductor Chip
Application:
10/124,595 →
Drive Circuit and Display Unit for Driving a Display Device and Portable Equipment
Application:
10/062,532 →
Semiconductor Package with a Chip Connected to a Wiring Substrate Using Bump Electrodes and Underfilled with Sealing Resin
Application:
10/062,433 →
Method for Manufacturing Semiconductor Wafer Having Resist Mask with Measurement Marks for Measuring the Accuracy of Overlay of a Photomask
Application:
10/061,332 →
Resist Mask Having Measurement Marks for Measuring the Accuracy of Overlay of a Photomask Disposed on Semiconductor Wafer
Application:
10/061,285 →
Process for Manufacturing a Packaged Semiconductor
Application:
10/057,907 →
Module Circuit Board for Semiconductor Device Having Barriers to Isolate I/O Terminals from Solder
Application:
10/022,285 →
Semiconductor Device and Method of Fabricating the Same
Application:
09/986,701 →
Multilayer Interconnection Structure of a Semiconductor Device
Application:
09/961,069 →
Semiconductor Integrated Circuit and Testing Method Thereof
Application:
09/946,514 →
Output Circuit for a Transmission System
Application:
09/932,030 →
Semiconductor Device and Process of Fabricating Same
Application:
09/930,136 →
Method of Forming a Ball Grid Array Package
Application:
09/917,712 →
Semiconductor Device and Manufacturing Method
Application:
09/917,710 →
Semiconductor Wafer and Method for Manufacturing Semiconductor Devices
Application:
09/916,320 →
Oscillation Stop Detection Circuit
Application:
09/908,552 →
Method for Manufacturing and Batch Testing Semiconductor Devices
Application:
09/904,663 →
Drive Control Circuit of Charged Pump Circuit
Application:
09/898,073 →
Semiconductor Apparatus and Semiconductor Apparatus Manufacturing Method
Application:
09/897,090 →
Voltage Generator
Application:
09/895,221 →
Transfer Molding Apparatus and Method for Manufacturing Semiconductor Devices
Application:
09/893,455 →
Video Signal Control Circuit
Application:
09/880,090 →
Semiconductor Device and Manufacturing Method Thereof
Application:
09/878,375 →
I/O Circuit of Semiconductor Integrated Device
Application:
09/867,531 →
Speech Synthesizer That Interrupts Audio Output to Provide Pause/Silence Between Words
Application:
09/814,065 →
Semiconductor memory circuit including a data output circuit
Application:
09/769,425 →