IP Library Granted Patent US 7,076,318
Granted Patent B2
US 7,076,318 · App. 10/712,100 · Granted Jul 11, 2006

Method and system for managing semiconductor manufacturing equipment

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Quick Facts
Patent No.
US 7,076,318
App. No.
10/712,100
Granted
Jul 11, 2006
Kind
B2
Abstract

A management method capable of making an accurate decision about a malfunction of the semiconductor manufacturing equipment includes sampling a plurality of data of at least one parameter under normal operating conditions of the semiconductor manufacturing equipment; generating a Mahalanobis space A from a group of sampled data; calculating a Mahalanobis distance from measured values of the parameter under ordinary operating conditions of the semiconductor manufacturing equipment; and deciding that a malfunction occurred in the semiconductor manufacturing equipment when the value of the Mahalanobis distance exceeds a predetermined value.

Claims (78)

1. A method of controlling semiconductor manufacturing equipment, comprising:

sampling a plurality of data;

generating a correlation matrix based on the plurality of data;

generating an inverse matrix of the correlation matrix in order to generate a Mahalanobis space;

generating a Mahalanobis distance based on the Mahalanobis space; and

generating a control signal which indicates that an operation of the semiconductor manufacturing equipment should be stopped when the Mahalanobis distance exceeds a threshold value.

2. The method of controlling semiconductor manufacturing equipment of claim 1 , wherein the plurality of data is plasma emission intensity.

3. The method of controlling semiconductor manufacturing equipment of claim 1 , further comprising generating an alarm when the Mahalanobis distance exceeds the threshold value.

4. The method of controlling semiconductor manufacturing equipment of claim 1 , further comprising:

standardizing the plurality of data obtained by said sampling to provide standardized data used during said generating a correlation matrix,

wherein said standardizing uses an equation

Y n·m =( Y′ n·m −Ave n )/σ n ,

wherein Y′ n·m is a sample data at an appointed time X n in m time sampling, Ave n is an average of a group of sample data measured at time X n , σ n is a standard deviation of data at time X n , and Y n,m is a standardized sample value at X n ,

whereby n is an integer from 1 to n and m is an integer from 1 to m.

5. The method of controlling semiconductor manufacturing equipment of claim 4 , wherein said generating a correlation matrix uses an equation

r

ij

=

r

ji

=

1

m

p

=

1

m

Y

i

·

p

Y

jp

,

wherein r ij and r ji are matrix elements and i and j are integers from 1 to n.

6. The method of controlling semiconductor manufacturing equipment of claim 5 , wherein said generating a Mahalanobis distance uses an equation

D

2

=

1

n

i

=

1

n

j

=

1

n

a

ij

Y

i

Y

j

,

wherein D is the Mahalanobis distance and a ij are matrix elements of the inverse matrix.

7. The method of controlling semiconductor manufacturing equipment of claim 1 , wherein the threshold value is within a range of 2 to 4.

8. The method of controlling semiconductor manufacturing equipment according to claim 1 , wherein the plurality of data are sampled based on a light intensity of plasma in a reaction chamber.

9. The method of controlling semiconductor manufacturing equipment according to claim 1 , wherein the plurality of data are sampled based on a change in an impedance of a reaction chamber.

10. The method of controlling semiconductor manufacturing equipment according to claim 9 , wherein the change in the impedance is based on a change in a voltage of a high frequency to be supplied to an electrode in the reaction chamber.

11. The method of controlling semiconductor manufacturing equipment according to claim 1 , wherein the plurality of data are sampled based on a voltage, a current and a phase of a supplied high frequency electric power.

12. A semiconductor device produced in accordance with the method of claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Feb 26, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022343/0290 →