Granted Patent
Utility
US 6,590,274
· Confirmation No. 9929
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-07-30 | TRNA |
Transmittal of New Application | 4 | View | |
| 2001-07-30 | A.PE |
Preliminary Amendment | 2 | View | |
| 2001-07-30 | SPEC |
Specification | 17 | View | |
| 2001-07-30 | CLM |
Claims | 6 | View | |
| 2001-07-30 | ABST |
Abstract | 1 | View | |
| 2001-07-30 | DRW |
Drawings-only black and white line drawings | 11 | View | |
| 2001-07-30 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Takashi Ohsumi
Tokyo, JAPAN
Yuzo Kato
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/620
H10W46/00
H10W46/501
H10W46/603
H10W72/01255
H10W72/922
H10W72/9223
H10W72/923
H10W46/503
H10W46/101
H10W72/9415
H10W70/60
H10W72/251
Prosecution
- Examiner
- WILSON, CHRISTIAN D
- Art Unit
- 2824
- Docket No.
- OKI.155D
- Confirmation No.
- 9929
Foreign Priority
065160
·
1999-03-11
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JAPAN
Publication
- Pub. No.
- US20010041425A1
- Pub. Date
- 2001-11-15
Patent Term Adjustment
-26days
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Quick Facts
- Patent No.
- US 6,590,274
- App. No.
- 09/916,320
- Filed
- 2001-07-30
- Granted
- 2003-07-08
- Pub. No.
- US20010041425A1
- Examiner
- WILSON, CHRISTIAN D
- Art Unit
- 2824
- PTA
- -26 days
External Links