Granted Patent
Utility
US 6,635,963
· Confirmation No. 4732
SEMICONDUCTOR PACKAGE WITH A CHIP CONNECTED TO A WIRING SUBSTRATE USING BUMP ELECTRODES AND UNDERFILLED WITH SEALING RESIN
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-08-04 | IFEE |
Issue Fee Payment (PTO-85B) | 2 | View | |
| 2002-02-05 | TRNA |
Transmittal of New Application | 4 | View | |
| 2002-02-05 | A.PE |
Preliminary Amendment | 4 | View | |
| 2002-02-05 | SPEC |
Specification | 28 | View | |
| 2002-02-05 | CLM |
Claims | 8 | View | |
| 2002-02-05 | ABST |
Abstract | 1 | View | |
| 2002-02-05 | DRW |
Drawings-only black and white line drawings | 14 | View | |
| 2002-02-05 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
257/737
H10P72/7402
H10P72/7416
H10W72/856
H10W74/15
H10W72/073
H10W72/241
H10P72/742
H10W72/072
H10W72/07236
H10W72/012
H10W74/012
H10W74/142
H10W74/014
H10W72/0198
H10W90/724
H10W72/5522
H10W72/30
H10W90/734
H10W74/01
H10W72/252
Prosecution
- Examiner
- SMOOT, STEPHEN W
- Art Unit
- 2813
- Customer No.
- 20987
- Docket No.
- OKI.145D
- Confirmation No.
- 4732
Foreign Priority
094832/99
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1999-04-01
·
JAPAN
Publication
- Pub. No.
- US20020119599A1
- Pub. Date
- 2002-08-29
Patent Term Adjustment
0days
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Quick Facts
- Patent No.
- US 6,635,963
- App. No.
- 10/062,433
- Filed
- 2002-02-05
- Granted
- 2003-10-21
- Pub. No.
- US20020119599A1
- Examiner
- SMOOT, STEPHEN W
- Art Unit
- 2813
- PTA
- 0 days
External Links