IP Library Granted Patent US 6,892,440
Granted Patent B2
US 6,892,440 · App. 09/963,982 · Granted May 17, 2005

Method for winding an embedded b-zero coil

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Quick Facts
Patent No.
US 6,892,440
App. No.
09/963,982
Granted
May 17, 2005
Kind
B2
Abstract

A method for winding on embedded b-zero coil maintains the integrity of superconducting main coil and the b-zero wire during coil winding and during normal operation of a superconducting MRI magnet. The b-zero coil is co-wound with an aluminum overwrap while the aluminum overwrap is being wound onto the superconducting MRI coil. The two-wire geometries are selected such that the height or thickness of the aluminum overwrap is greater than or equal to the height or thickness of the b-zero coil wire. The b-zero coil wire sits in a cavity that is created by adjacent turns.

Claims (21)

1. A method of forming a b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) about a superconducting main ( 20 , 22 , 24 26 , 28 and 30 ) coil for use in magnetic resonance imaging comprising the steps of

providing a superconducting magnet coil ( 60 );

overlaying the superconducting magnet coil ( 60 ) with a layer of insulation material ( 62 );

winding a b-zero coil wire ( 70 ) into at least one layer about said insulation layer ( 62 ) to form a b-zero superconducing coil ( 40 , 42 , 44 , 46 , 48 and 50 );

co-winding with said b-zero coil wire ( 70 ) a second wire ( 80 );

wherein adjacent windings of such second wire ( 80 ) form a cavity ( 72 ) therebetween; and

wherein adjacent windings of b-zero coil wire ( 70 ) lie within such cavity ( 72 ).

2. The method of forming a b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 1 including the additional steps of overlaying the layer of b-zero coil wire ( 70 ) with at least one layer of second wire ( 82 ).

3. The method of forming a b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 2 wherein said b-zero wire ( 70 ) is made of superconducting wire.

4. The method of forming a b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 3 wherein said second wire ( 80 ) is made of aluminum.

5. A method of forming an embedded b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) about a superconducting main coil ( 20 , 22 , 24 26 , 28 and 30 ) for use in magnetic resonance imaging comprising the steps of

providing a superconducting magnet coil ( 60 );

overlaying the superconducting magnet coil ( 60 ) with a layer of insulation material ( 62 );

winding a b-zero coil wire ( 70 ) into at least one layer about said insulation layer ( 62 ) to form a b-zero superconducting coil ( 40 , 42 , 44 , 46 , 48 and 50 );

co-winding a second wire with said b-zero coil wire ( 70 );

wherein adjacent windings of such second wire ( 80 ) form a cavity ( 72 ) therebetween; and

wherein adjacent windings of b-zero coil wire ( 70 ) lie within such cavity ( 72 ).

6. The method of forming an embedded b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 5 wherein said winding and co-winding is controlled to provide spaces between adjacent windings.

7. The method of forming an embedded b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 6 including the additional step of overlaying the layer of b-zero coil wire ( 70 ) with at least one layer of second wire ( 80 ).

8. The method of forming an embedded b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 7 wherein said b-zero wire ( 70 ) is made of superconducting wire.

9. The method of forming an embedded b-zero coil ( 40 , 42 , 44 , 46 , 48 and 50 ) of claim 8 wherein said second wire ( 80 ) is made of aluminum.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2001
From: ELGIN, II, STEPHEN R.; EGGLESTON, MICHAEL R.; XU, MINFENG
To: GE MEDICAL SYSTEMS GLOBAL TECHNOLOGY COMPANY, LLC
Reel/Frame 012286/0025 →