IP Library Granted Patent US 6,498,052
Granted Patent Utility
US 6,498,052 · Confirmation No. 8774

CIRCUIT, METHOD OF ADHERING AN INTEGRATED CIRCUIT DEVICE TO A SUBSTRATE, AND METHOD OF FORMING A CIRCUIT

Inventor: Joseph M. Brand
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Code Description Pages PDF
2001-10-09 TRNA Transmittal of New Application 3 View
2001-10-09 A.PE Preliminary Amendment 15 View
2001-10-09 SPEC Specification 17 View
2001-10-09 CLM Claims 15 View
2001-10-09 ABST Abstract 1 View
2001-10-09 DRW Drawings-only black and white line drawings 4 View
2001-10-09 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,498,052
App. No.
09/974,001
Filed
2001-10-09
Granted
2002-12-24
Pub. No.
US20020028535A1
Art Unit
2812
PTA
0 days