IP Library › Granted Patent US 6,666,959
Granted Patent Utility
US 6,666,959 · Confirmation No. 2924

SEMICONDUCTOR WORKPIECE PROXIMITY PLATING METHODS AND APPARATUS

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2008-12-15 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2008-12-01 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-10-29 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-10-29 LET. Miscellaneous Incoming Letter 2 View
2001-10-11 TRNA Transmittal of New Application 1 View
2001-10-11 A.PE Preliminary Amendment 3 View
2001-10-11 A.PE Preliminary Amendment 2 View
2001-10-11 SPEC Specification 3 View
2001-10-11 SPEC Specification 3 View
2001-10-11 SPEC Specification 3 View
2001-10-11 SPEC Specification 3 View
2001-10-11 SPEC Specification 3 View
2001-10-11 SPEC Specification 1 View
2001-10-11 CLM Claims 3 View
2001-10-11 CLM Claims 3 View
2001-10-11 CLM Claims 3 View
2001-10-11 ABST Abstract 1 View
2001-10-11 DRW Drawings-only black and white line drawings 3 View
2001-10-11 DRW Drawings-only black and white line drawings 3 View
2001-10-11 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,666,959
App. No.
09/976,972
Filed
2001-10-11
Granted
2003-12-23
Pub. No.
US20020020621A1
Art Unit
1742
PTA
0 days