Patent Assignment
Reel/Frame 019000/0080
Assignment of Assignor's Interest
Recorded: 2007-03-12
Pages: 26
Assignor
ASM NUTOOL, INC.
Executed: 2006-12-04
Assignee
NOVELLUS SYSTEMS, INC.
4000 N. FIRST STREET, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(157)
Reverse Linear Polisher with Loadable Housing
Patent:
6,103,628 →
Application:
09/201,928 →
Method and Apparatus for Electro-Chemical Mechanical Deposition
Patent:
6,176,992 →
Application:
09/201,929 →
Apparatus for Forming an Electrical Contact with a Semicondctor Substrate
Patent:
6,251,235 →
Application:
09/283,024 →
Method and Apparatus for Plating and Polishing a Semiconductor Substrate
Patent:
6,328,872 →
Application:
09/285,621 →
Method and Apparatus for Simultaneously Cleaning and Annealing a Workpiece
Patent:
6,692,588 →
Application:
09/351,868 →
Method and Apparatus for Depositing and Controlling the Texture of a Thin Film
Patent:
6,409,904 →
Application:
09/373,681 →
Novel Chip Interconnect and Packaging Deposition Methods and Structures
Patent:
6,355,153 →
Application:
09/398,258 →
Vertically Configured Chamber Used for Multiple Processes
Patent:
6,352,623 →
Application:
09/466,014 →
Work Piece Carrier Head for Plating and Polishing
Patent:
6,612,915 →
Application:
09/472,523 →
Workpiece Proximity Plating Apparatus
Patent:
6,630,059 →
Application:
09/483,095 →
Pad Designs and Structures for a Versatile Materials Processing Apparatus
Patent:
6,413,388 →
Application:
09/511,278 →
Methods for Repairing Defects on a Semiconductor Substrate
Patent:
6,582,579 →
Application:
09/534,704 →
Modified Plating Solution for Plating and Planarization and Process Utilizing Same
Patent:
6,354,916 →
Application:
09/544,558 →
Anode Assembly for Plating and Planarizing a Conductive Layer
Patent:
6,478,936 →
Application:
09/568,584 →
Reverse linear polisher with loadable housing
Patent:
6,207,572 →
Application:
09/576,064 →
Method and Apparatus for Electro Chemical Mechanical Deposition
Patent:
6,676,822 →
Application:
09/607,567 →
Method and Apparatus Employing Pad Designs and Structures with Improved Fluid Distribution
Patent:
6,413,403 →
Application:
09/621,969 →
Polishing Apparatus and Method with a Refreshing Polishing Belt and Loadable Housing
Patent:
6,468,139 →
Application:
09/684,059 →
Device Providing Electrical Contact to the Surface of a Semiconductor Workpiece During Metal Plating
Patent:
6,497,800 →
Application:
09/685,934 →
Method of and Apparatus for Making Electrical Contact to Wafer Surface for Full-Face Electroplating or Electropolishing
Method and Apparatus for Electroplating and Electropolishing
Plating Method and Apparatus That Creates a Differential Between Additive Disposed on a Top Surface and a Cavity Surface of a Workpiece Using an External Influence
Method and Apparatus for Electrodeposition of Uniform Film with Minimal Edge Exclusion on Substrate
Integrated System for Processing Semiconductor Wafers
Electroetching Process and System
Anode Designs for Planar Metal Deposits with Enhanced Electrolyte Solution Blending and Process of Supplying Electrolyte Solution Using Such Designs
Apparatus for Controlling Thickness Uniformity of Electroplated and Electroetched Layers
Method for Forming an Electrical Contact with a Semiconductor Substrate
Polishing Apparatus and Method with Belt Drive System Adapted to Extend the Lifetime of a Refreshing Polishing Belt Provided Therein
Packaging Deposition Methods
Method of Sealing Wafer Backside for Full-Face Electrochemical Plating
Plating Method and Apparatus That Creates a Differential Between Additive Disposed on a Top Surface and a Cavity Surface of a Workpiece Using an Indirect External Influence
Apparatus for Plating and Polishing a Semiconductor Workpiece
Plating Method and Apparatus for Controlling Deposition on Predetermined Portions of a Workpiece
Method and System to Provide Material Removal and Planarization Employing a Reactive Pad
Chemical Mechanical Polishing Endpoint Detection
Semiconductor Workpiece Proximity Plating Methods and Apparatus
Method and Apparatus for Avoiding Particle Accumulation in Electrodeposition
Planarity Detection Methods and Apparatus for Electrochemical Mechanical Processing Systems
Method and System to Provide Electroplanarization of a Workpiece with a Conducting Material Layer
Electrochemical Edge and Bevel Cleaning Process and System
Method of Using Vertically Configured Chamber Used for Multiple Processes
Vertically Configured Chamber Used for Multiple Processes
Carrier Head for Holding a Wafer and Allowing Processing on a Front Face Thereof to Occur
Edge and Bevel Cleaning Process and System
Chemical Mechanical Polishing Endpoint Detection
Method and Apparatus for Forming an Electrical Contact with a Semiconductor Substrate
Chemical Mechanical Polishing Apparatus and Methods Using a Flexible Pad and Variable Fluid Flow for Variable Polishing
Electroetching Methods and Systems Using Chemical and Mechanical Influence
Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
Pad Tensioning Method and System in a Bi-Directional Linear Polisher
Single Drive System for a Bi-Directional Linear Chemical Mechanical Polishing Apparatus
Pad Designs and Structures for a Versatile Materials Processing Apparatus
Low-Force Electrochemical Mechanical Processing Method and Apparatus
Method and Apparatus of Sealing Wafer Backside for Full-Face Electrochemical Plating
Method and Apparatus for Depositing and Controlling the Texture of a Thin Film
Advanced Chemical Mechanical Polishing System with Smart Endpoint Detection
Distributed Control System for Semiconductor Manufacturing Equipment
Multi Step Electrodeposition Process for Reducing Defects and Minimizing Film Thickness
Method for Electrochemically Processing a Workpiece
Method and Apparatus for Electro-Chemical Mechanical Deposition
Anode Assembly for Plating and Planarizing a Conductive Layer
Polishing Apparatus and Method with Belt Drive System Adapted to Extend the Lifetime of a Refreshing Polishing Belt Provided Therein
Fabrication of Semiconductor Interconnect Structures
Method and Apparatus for Full Surface Electrotreating of a Wafer
Method and System to Provide Electrical Contacts for Electrotreating Processes
Method and Structure for Thru-Mask Contact Electrodeposition
Method and System to Provide Electrical Contacts for Electrotreating Processes
Electrochemical Mechanical Processing with Advancible Sweeper
Apparatus for Electroprocessing a Workpiece Surface
Extensible Exam Language (Xxl) Protocol for Computer Based Testing
Appartus and Method for Loading a Wafer in Polishing System
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact
Application:
10/302,213 →
Publication:
US 2003/0070930
In-situ endpoint detection for non-transparent polishing member
Electrochemical Edge and Bevel Cleaning Process and System
Advanced Chemical Mechanical Polishing System with Smart Endpoint Detection
Method and Structure to Reduce Defects in Integrated Circuits and Substrates
Long-Life Workpiece Surface Influencing Device Structure and Manufacturing Method
Integrated System for Processing Semiconductor Wafers
Defect-Free Thin and Planar Film Processing
Method and Apparatus for Planar Material Removal Technique Using Multi-Phase Process Environment
Electropolishing System and Process
Chip Interconnect and Pacaging Deposition Methods and Structures
Method for Reduction of Defects in Wet Processed Layers
Method and System Monitoring and Controlling Film Thickness Profile During Plating and Electroetching
Device Providing Electrical Contact to the Surface of a Semiconductor Workpiece During Processing
Device Providing Electrical Contact to the Surface of a Semiconductor Workpiece During Processing
Device Providing Electrical Contact to the Surface of a Semiconductor Workpiece During Processing
Method and Apparatus for Processing a Substrate with Minimal Edge Exclusion
Advanced Bi-Directional Linear Polishing System and Method
Fluid Bearing Slide Assembly for Workpiece Polishing
Reduction of defects in conductive layers during electroplating
Application:
10/637,243 →
Publication:
US 2005/0029106
Method and System for Optically Enhanced Metal Planarization
Method and Apparatus for Eliminating Defects and Improving Uniformity in Electrochemically Processed Conductive Layers
Constant Low Force Wafer Carrier for Electrochemical Mechanical Processing and Chemical Mechanical Polishing
Conductive Structure Fabrication Process Using Novel Layered Structure and Conductive Structure Fabricated Thereby for Use in Multi-Level Metallization
Edge and bevel cleaning process and system
Application:
10/676,895 →
Publication:
US 2004/0140287
Process and System for Eliminating Gas Bubbles During Electrochemical Processing
Process and apparatus for air bubble removal during electrochemical processing
Application:
10/692,953 →
Publication:
US 2004/0182715
Methods for depositing high yield and low defect density conductive films in damascene structures
Application:
10/698,878 →
Publication:
US 2005/0095854
Electrochemical mechanical processing using low temperature process environment
Application:
10/705,360 →
Publication:
US 2004/0170753
Method and Apparatus for Localized Material Removal by Electrochemical Polishing
Process and system for providing electrochemical processing solution with reduced oxygen and gas content
Application:
10/772,687 →
Publication:
US 2004/0222100
Method of wafer processing with edge seed layer removal
Application:
10/782,697 →
Publication:
US 2006/0137994
Method of supplying solution for electrochemical processes from double-cavity electrode housing
Application:
10/784,191 →
Publication:
US 2004/0163963
Apparatus of Sealing Wafer Backside for Full-Face Processing
Means to Improve Center to Edge Uniformity of Electrochemical Mechanical Processing of Workpiece Surface
Advanced Chemical Mechanical Polishing System with Smart Endpoint Detection
Method of reducing post-CMP defectivity
Application:
10/818,976 →
Publication:
US 2004/0259348
System for Electropolishing and Electrochemical Mechanical Polishing
Device Providing Electrical Contact to the Surface of a Semiconductor Workpiece During Processing
Electrochemical Mechanical Processing Apparatus
Method and Structure to Improve Reliability of Copper Interconnects
Method for Controlling Thickness Uniformity of Electroplated Layers
System for fault-tolerant fluid level sensing and switching
Application:
10/876,859 →
Publication:
US 2007/0051173
Method and system for controlled material removal by electrochemical polishing
Application:
10/902,241 →
Publication:
US 2009/0020437
Anode assembly for plating and planarizing a conductive layer
Application:
10/914,490 →
Publication:
US 2005/0040049
Edge and Bevel Cleaning Process and System
Method and Apparatus for Plating and Polishing Semiconductor Substrate
Apparatus for Processing Surface of Workpiece with Small Electrodes and Surface Contacts
System and method for electroless surface conditioning
Application:
10/976,534 →
Publication:
US 2005/0170080
System and method for applying constant pressure during electroplating and electropolishing
Application:
10/984,272 →
Publication:
US 2005/0101138
Method for Electrochemically Processing a Workpiece
Electroetching methods and systems using chemical and mechanical influence
Application:
10/996,165 →
Publication:
US 2005/0133380
Method and system for material removal and planarization
Application:
11/011,529 →
Publication:
US 2005/0150777
Electroetching process and system
Application:
11/054,053 →
Publication:
US 2005/0145489
Apparatus for avoiding particle accumulation in electrochemical processing
Application:
11/057,297 →
Publication:
US 2005/0145484
System for electrochemical mechanical polishing
Application:
11/069,202 →
Publication:
US 2005/0173260
Method and System for Electroprocessing Conductive Layers
Method of Making Rolling Electrical Contact to Wafer Front Surface
System and Method for Electrochemical Mechanical Polishing
Solution for electrochemical mechanical polishing
Application:
11/185,591 →
Publication:
US 2007/0017818
Plating Method and Apparatus for Controlling Deposition on Predetermined Portions of a Workpiece
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
Application:
11/200,767 →
Publication:
US 2005/0279641
Method for substrate rinsing
Application:
11/218,385 →
Publication:
US 2007/0051389
Method for Controlling Conductor Deposition on Predetermined Portions of a Wafer
Method and apparatus for processing a substrate with minimal edge exclusion
Application:
11/225,913 →
Publication:
US 2006/0006060
Defect-free thin and planar film processing
Application:
11/226,511 →
Publication:
US 2006/0009033
Multi step electrodeposition process for reducing defects and minimizing film thickness
Application:
11/232,026 →
Publication:
US 2006/0011485
Method of Forming Contact Layers on Substrates
Method and apparatus for establishing additive differential on surfaces for preferential plating
Application:
11/237,991 →
Publication:
US 2006/0081477
Method for reduction of gap fill defects
Application:
11/238,886 →
Publication:
US 2006/0183321
Method and Apparatus for Forming an Electrical Contact with a Semiconductor Substrate
Apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
Application:
11/280,540 →
Publication:
US 2006/0096702
Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
Application:
11/283,004 →
Publication:
US 2006/0131177
Process for conditioning conductive surfaces after electropolishing
Application:
11/283,112 →
Publication:
US 2007/0111523
Chip interconnect and packaging deposition methods and structures
Application:
11/295,014 →
Publication:
US 2006/0070885
Method of depositing materials on full face of a wafer
Application:
11/313,249 →
Publication:
US 2007/0141818
Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate
Application:
11/343,477 →
Publication:
US 2006/0118425
Electrode and Pad Assembly for Processing Conductive Layers
Conductive materials for low resistance interconnects and methods of forming the same
Application:
11/351,914 →
Publication:
US 2006/0228934
Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece
Electrochemical Processing of Conductive Surface
Efficient Wafer Processing Technology
Integrated system for processing semiconductor wafers
Application:
11/452,609 →
Publication:
US 2007/0004316
Means to Improve Center to Edge Uniformity of Electrochemical Mechanical Processing of Workpiece Surface
Application:
11/564,242 →
Publication:
US 2007/0131563
Fabrication of Semiconductor Interconnect Structures
Application:
11/672,005 →
Publication:
US 2007/0128851
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.