Endpoint detection for non-transparent polishing member

1. A polishing apparatus for polishing a workpiece comprising:

a workpiece holder configured to hold the workpiece;

a flexible polishing pad configured to be positioned adjacent to a surface of the workpiece to polish the workpiece with a front side of the polishing pad;

a platen having a plurality of holes positioned on a back side of the polishing pad and configured to supply and exhaust a fluid through the holes to selectively apply pressure to the polishing pad;

an endpoint sensor for detecting a processing endpoint of the workpiece;

a mechanism coupled to the endpoint sensor and configured to move the endpoint sensor between the front side of the polishing pad and the surface of the workpiece; and

a fluid controller coupled to the sensor and configured to adjust the fluid pressure based in part on signals from the endpoint sensor.

2. The polishing apparatus of claim 1 further comprising a light source coupled to the mechanism and configured to emit a light against a surface of the workpiece wherein the endpoint sensor determines the processing endpoint in response to a reflected light.

3. The polishing apparatus of claim 2 , wherein the light source emits multi-spectrum incident light and the endpoint sensor senses a multi-spectrum reflection.

4. The polishing apparatus of claim 3 , further comprising a decision circuit having a comparator to compare the multi-spectrum reflection from the surface of the workpiece against a threshold reflection color, and wherein a decision whether the processing endpoint has been reached is based upon reflection color comparison data from the comparator.

5. The polishing apparatus of claim 4 , wherein the threshold reflection color is based upon at least one of the group consisting of:

silicon dioxide (SiO 2 );

silicon nitride (Si 3 N 4 );

copper (Cu);

tantalum (Ta);

tantalum nitride (TaN);

tantalum/tantalum nitride (Ta/TaN); and

an insulating layer.

6. The polishing apparatus of claim 3 , wherein the endpoint sensor is configured to sense light in the wavelength range spanning from 400-800 nm.

7. The polishing apparatus of claim 2 , wherein the light source emits white incident light and the endpoint sensor senses a red-green-blue (RGB) reflection.

8. The polishing apparatus of claim 2 , wherein the light source and the endpoint sensor are configured to scan the surface of the semiconductor wafer.

9. The polishing apparatus of claim 2 , further comprising a color sensor to sense a reflection color from the surface of the workpiece and generate a sensor signal.

10. The polishing apparatus of claim 9 , wherein the decision circuit further comprises a comparator to compare the reflection color from the surface of the workpiece against a threshold reflection color, and wherein the decision whether the processing endpoint has been reached is based upon reflection color comparison data from the computer.

11. The polishing apparatus of claim 10 , wherein the threshold reflection color is based upon at least one of the group consisting of:

silicon dioxide (SiO 2 );

silicon nitride (Si 3 N 4 );

copper (Cu);

tantalum (Ta);

tantalum nitride (TaN);

tantalum/tantalum nitride (Ta/TaN); and

an insulating layer.

12. The polishing apparatus of claim 10 , wherein the polishing apparatus is configured to polish a workpiece having a hydrophilic layer and a hydrophobic layer.

13. The polishing apparatus of claim 10 , wherein the workpiece includes an upper copper (Cu) layer and a lower barrier layer, and wherein the threshold reflecting color is based on barrier layer reflection.

14. A polishing apparatus of claim 9 , further comprising a decision circuit coupled to the color sensor and configured to decide whether the workpiece processing endpoint has been reached based at least in part on the sensor signal.

15. The polishing apparatus of claim 1 , wherein the polishing apparatus is configured to polish a workpiece having a hydrophilic layer and a hydrophobic layer.

16. A polishing apparatus for polishing a surface of a workpiece, comprising:

a flexible polishing pad configured to be positioned adjacent to the surface of the workpiece to polish the surface of the workpiece with a front side of the polishing pad;

a platen having a plurality of holes positioned on a back side of the polishing pad and configured to supply and exhaust a fluid through the holes to selectively apply pressure to the polishing pad;

an endpoint sensor configured to detect a processing endpoint of the workpiece when the polishing apparatus is in a non-polishing mode; and

a fluid controller coupled to the endpoint sensor and configured to adjust the fluid pressure based in part on signals from the endpoint sensor.

17. The polishing apparatus of claim 16 , further comprising a mechanism coupled to the endpoint sensor and configured to move the endpoint sensor between the front side of the polishing pad and the surface of the workpiece.

18. The polishing apparatus of claim 17 , further comprising a light source coupled to the mechanism and configured to emit a light against the surface of the workpiece wherein the endpoint sensor determines the processing endpoint in response to a reflected light.

19. The polishing apparatus of claim 18 , wherein the light source emits multi-spectrum incident light and the endpoint sensor senses a multi-spectrum reflection.

20. The polishing apparatus of claim 18 , wherein the light source emits white incident light and the endpoint sensor senses a red-green-blue (RGB) reflection.