Apparatus and method for loading a wafer in polishing system
View Patent ↗The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
1. A method of processing a semiconductor wafer comprising:
positioning the wafer below a wafer housing;
supporting the wafer around, its periphery; and
loading the wafer into a wafer housing cavity.
2. The method of claim 1 , further comprising extending a support structure proximate to the wafer periphery.
3. The method of claim 1 , further comprising retracting a support structure from proximate to the wafer periphery.
4. The method of claim 2 , further comprising retracting the support structure from proximate to the wafer periphery.
5. The method of claim 2 , further comprising housing the support structure in a movable support structure housing.
6. The method of claim 5 , further comprising moving the support structure housing in an upward and downward direction.
7. The method of claim 1 , further comprising treating the wafer.
8. The method of claim 1 , further comprising:
releasing the wafer from the wafer housing cavity;
supporting the wafer around its periphery; and
unloading the wafer from the wafer housing.
9. A method of processing a semiconductor wafer comprising:
positioning the wafer in a cavity of a wafer housing;
positioning a retractable support structure below the surface of the wafer;
extending the support structure to support the wafer;
moving the support structure so that the wafer is positioned near the surface of the wafer housing; and
clearing the support structure from the surface of the wafer.
10. The method of claim 9 , further comprising securing the wafer against the surface of the wafer housing.
11. The method of claim 9 , further comprising housing the support structure in a movable support structure housing.
12. The method of claim 11 , further comprising moving the support structure housing in an upward and downward direction.
13. The method of claim 9 , further comprising aligning the wafer housing with the wafer.
14. The method of claim 9 , further comprising treating the wafer.
15. The method of claim 9 , further comprising:
positioning the support structure below the surface of the wafer;
extending the support structure to support the wafer; and
moving the support structure so that the wafer is moved away from the surface of the wafer housing.
16. A semiconductor wafer processing device comprising:
a wafer housing; and
a support structure attached to the wafer housing configured to load a wafer into a wafer housing cavity.
17. The semiconductor wafer processing device of claim 16 , wherein the support structure comprises retractable members.
18. The semiconductor wafer processing device of claim 17 , wherein the support structure comprises at least three retractable members.
19. The semiconductor wafer processing device of claim 17 , wherein the retractable members are retractable pins.
20. The semiconductor wafer processing device of claim 16 , wherein the support structure is further configured to unload the wafer from the wafer housing cavity.
21. The semiconductor wafer processing device of claim 16 , further comprising a movable support structure housing configured to house the support structure and to move in an upward and downward direction to load the wafer into the wafer housing cavity.
22. A semiconductor wafer processing device comprising a head assembly having a cavity adapted to support a wafer and a movable pin housing that includes pins adapted to protrude in and out of the pin housing.
23. The semiconductor wafer processing device of claim 22 ,further comprising a motor configured to move the pin housing in an upward and downward direction.
24. The semiconductor wafer processing device of claim 22 , further comprising a vacuum configured to secure the wafer in the cavity.