Advanced Bi-directional linear polishing system and method
View Patent ↗The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.
1. A method of creating a bi-directional linear movement of a portion of a polishing pad disposed within a processing area for polishing of a workpiece comprising the steps of:
contacting a backside of the polishing pad with a slide member to produce the bi-directional linear movement of the portion of the polishing pad within the processing area for polishing the workpiece.
2. The method according to claim 1 , wherein the polishing pad is disposed between a supply spool and a receive spool.
3. The method according to claim 1 , wherein the polishing pad passes through rollers disposed on the slide member.
4. The method according to claim 1 , wherein the step of contacting provides horizontal bi-directional linear movement of the slide member and horizontal bi-directional linear movement of the portion of the polishing pad within the processing area.
5. The method according to claim 4 , wherein the portion of the polishing pad moves horizontally at least two times as far as the slide member moves horizontally.
6. The method according to claim 1 , wherein the portion of the polishing pad moves a greater amount than the slide member.
7. The method according to claim 1 , wherein the step of contacting includes guiding the polishing pad on a plurality of rollers.
8. The method according to claim 7 , wherein the step of guiding includes physically contacting a back surface of the polishing pad with the plurality of rollers.
9. The method according to claim 1 , wherein the step of contacting the backside of the polishing pad includes passing the polishing pad through rollers disposed on the slide member.
10. The method according to claim 1 , wherein the step of contacting the backside of the polishing pad includes moving a drive assembly bi-directionally to produce the bi-directional linear movement of the portion of the polishing pad within the processing area.
11. An apparatus for creating bi-directional linear motion within a predetermined area with a portion of a polishing pad corresponding to a processing area for polishing a workpiece comprising:
a drive assembly;
a slide member coupled to the drive assembly, the drive assembly configured to produce bi-linear movement of the slide member; and
wherein the polishing pad is disposed through the slide member and bi-linear movement of the slide member creates a corresponding bi-linear movement of the portion of the polishing pad in the processing area for polishing the workpiece.
12. The apparatus according to claim 11 , wherein the drive assembly includes:
a gear box coupled to a rotatable shaft and which contains another rotatable shaft;
a crank coupled to the another rotatable shaft; and
a link coupled between the rotatable shaft and the slide member.
13. The apparatus according to claim 11 , wherein the slide member includes a plurality of rollers.
14. The apparatus according to claim 11 , wherein the bi-linear movement of the slide member is horizontal.
15. The apparatus according to claim 11 , wherein the bi-linear movement of the portion of the polishing pad in the processing area is horizontal.
16. The apparatus according to claim 11 further comprising:
a supply spool;
a receive spool; and
a plurality of rollers configured to provide a pad path between a supply spool and a receive spool.
17. The apparatus according to claim 16 , wherein the plurality of rollers is configured to contact a back surface of the polishing pad.