Advanced chemical mechanical polishing system with smart endpoint detection
View Patent ↗The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.
1. A polishing apparatus for polishing a surface of a workpiece comprising:
a holder configured to hold the workpiece;
a flexible polishing pad having a polishing side and a back side configured to polish the surface of the workpiece;
a platen having a plurality of openings configured on the back side of the polishing pad to receive and exhaust fluid to selectively apply pressure to the polishing pad; and
at least one sensor disposed in the platen configured to detect a property of the surface of the workpiece.
2. The apparatus of claim 1 further comprising a fluid supply unit coupled to the plurality of openings on the platen and configured to supply fluid to at least some of the plurality of openings.
3. The apparatus of claim 2 , wherein:
the platen includes a plurality of pressure zones each zone having a plurality of openings; and
the fluid supply unit is configured to selectively supply fluid to each of the plurality of pressure zones.
4. The apparatus of claim 1 , wherein the polishing pad is a belt configured to move in a bi-directional linear motion.
5. The apparatus of claim 3 further comprising at least one pressure control device coupled between a pressure zone and the fluid supply unit configured to regulate fluid pressure at the pressure zone.
6. The apparatus of claim 5 , wherein each pressure zone includes at least one corresponding pressure control device.
7. The apparatus of claim 5 , wherein the pressure control device regulates negative and positive pressures to the pressure zone.
8. The apparatus of claim 5 , wherein the pressure control device leaks fluid to maintain a selected pressure at the pressure zone.
9. The apparatus of claim 1 , wherein the fluid is air.
10. A method of polishing a workpiece comprising the steps;
holding the workpiece proximate to a polishing pad;
polishing a face of the workpiece with a front side of the polishing pad;
supplying and exhausting fluid through a platen having a plurality of holes to selectively apply fluid pressure to a backside of the polishing pad; and
detecting a property of the face of the workpiece.
11. The method of claim 10 further comprising the step of maintaining a selected fluid pressure against the backside of the polishing pad.
12. The method of claim 11 , wherein the platen includes a plurality of pressure zones each zone including at least some of the plurality of the holes and at least one sensor associated with the pressure zones and the step of supplying and exhausting includes selectively applying fluid pressure to an area of the backside of the polishing pad corresponding to a particular pressure zone.
13. The method of claim 12 , wherein the step of maintaining includes regulating the fluid pressure at the pressure zones.
14. The method of claim 13 , wherein the step of regulating the fluid pressure includes leaking fluid to the atmosphere.
15. The method of claim 13 , wherein the step of regulating the fluid pressure includes applying negative and positive pressures to the pressure zones.
16. The method of claim 10 , wherein the polishing pad is a belt and the polishing step includes moving the pad in a bidirectional linear motion.
17. The method of claim 10 , wherein the fluid is air.
18. A method of polishing a workpiece comprising the steps:
polishing a face of the workpiece with a front side of the polishing pad;
supplying fluid through a plurality of holes in a platen to apply pressure to the polishing pad; and
exhausting at least some of the fluid through some of the plurality of holes in the platen to control the pressure to the polishing pad.
19. The method of claim 18 , wherein the platen includes a plurality of pressure zones each zone including at least some of the plurality of the holes and the method further comprising the step of applying a particular pressure corresponding to a particular pressure zone to selectively assert pressure to a particular area of the polishing pad.
20. The method of claim 10 , wherein the step of polishing includes moving the polishing pad bi-directional.