IP Library › Patent Application 10637243
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App. No. 10/637,243 · Confirmation No. 3011

Reduction of defects in conductive layers during electroplating

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2007-07-31 ABN Abandonment 2 View
2007-07-31 EXIN Examiner Interview Summary Record (PTOL - 413) 2 View
2007-01-10 CTNF Non-Final Rejection 12 View
2007-01-10 892 List of references cited by examiner 1 View
2007-01-10 1449 List of References cited by applicant and considered by examiner 2 View
2007-01-10 BIB Bibliographic Data Sheet 1 View
2007-01-10 FWCLM Index of Claims 1 View
2007-01-10 SRFW Search information including classification, databases and other search related notes 1 View
2007-01-04 SRNT Examiner's search strategy and results 1 View
2005-12-15 STATUS.LET Request for status of Application 1 View
2005-12-09 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2005-03-21 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2005-03-21 136A Authorization for Extension of Time all replies 4 View
2005-03-21 FOR Foreign Reference 32 View
2005-03-21 FOR Foreign Reference 26 View
2005-03-14 N570 Communication - Re: Power of Attorney (PTOL-308) 2 View
2005-02-17 PA.. Power of Attorney 5 View
2004-03-12 OATH Oath or Declaration filed 12 View
2004-03-12 DRW Drawings-only black and white line drawings 4 View
2003-11-12 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2003-11-06 PEFN Pre-Exam Formalities Notice 2 View
2003-08-07 TRNA Transmittal of New Application 2 View
2003-08-07 SPEC Specification 8 View
2003-08-07 CLM Claims 2 View
2003-08-07 ABST Abstract 1 View
2003-08-07 DRW Drawings-only black and white line drawings 4 View
2003-08-07 WFEE Fee Worksheet (SB06) 1 View
2003-08-07 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/637,243
Filed
2003-08-07
Pub. No.
US20050029106A1
Art Unit
1753