Apparatus for electroprocessing a workpiece surface
View Patent ↗The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
1. An apparatus for electroprocessing a workpiece having a conductive layer using a solution comprising:
a head adapted to hold the workpiece and configured to rotate about a first axis;
an electrode configured to allow a potential difference to be applied between the electrode and the conductive layer, the electrode having a plurality of holes therethrough and configured to rotate about a second axis perpendicular to the first axis;
a pad disposed in close proximity to the conductive layer of the workpiece, a surface of the pad being configured to polish the conductive layer while the potential difference and the solution are applied onto the conductive layer; and
a solution chamber holding a process solution, wherein the electrode is between the solution chamber and the pad and wherein the pad and electrode are configured to allow the solution to be continuously flowed from the chamber through the holes of the electrode to the conductive layer.
2. The apparatus of claim 1 , wherein the pad is attached to the electrode.
3. The apparatus of claim 2 , further comprising means for introducing the solution to the conductive layer of the workpiece.
4. The apparatus of claim 3 , wherein the means for introducing the solution recirculates the solution.
5. The apparatus of claim 3 , wherein the means for introducing the solution comprises a channel including a passage in the electrode.
6. The apparatus of claim 2 , wherein a plurality of pads are attached to the electrode and positioned between the electrode and the conductive layer of the workpiece.
7. The apparatus of claim 2 , wherein the conductive layer is copper.
8. The apparatus of claim 1 , wherein the conductive layer is copper.
9. The apparatus of claim 1 , wherein the electrode is cylindrical.
10. The apparatus of claim 1 , wherein the pad is circular.
11. The apparatus of claim 1 , wherein the pad is belt-shaped.