IP Library Granted Patent US 6,609,915
Granted Patent Utility
US 6,609,915 · Confirmation No. 2935

INTERCONNECT FOR ELECTRICALLY CONNECTING A MULTICHIP MODULE TO A CIRCUIT SUBSTRATE AND PROCESSES FOR MAKING AND USING SAME

⬇ PDF
Code Description Pages PDF
2019-06-05 OATH Oath or Declaration filed 47 View
2017-07-12 C.AD.PAIR Change of Address via Patent Application Information Retrieval (PAIR) 1 View
2017-04-26 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-04-26 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-04-17 PA.. Power of Attorney 2 View
2017-04-17 R3.73 Assignee showing of ownership per 37 CFR 3.73 3 View
2017-04-17 N417 Electronic Filing System Acknowledgment Receipt 2 View
2007-08-27 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-11-30 TRNA Transmittal of New Application 5 View
2001-11-30 SPEC Specification 14 View
2001-11-30 CLM Claims 7 View
2001-11-30 ABST Abstract 1 View
2001-11-30 DRW Drawings-only black and white line drawings 5 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,609,915
App. No.
10/000,819
Filed
2001-11-30
Granted
2003-08-26
Pub. No.
US20030104713A1
Art Unit
2833
PTA
-125 days