Patent Assignment
Reel/Frame 033094/0826
Security Interest
Recorded: 2014-06-05
Pages: 17
Assignors
SANMINA CORPORATION, AS GRANTOR
Executed: 2014-06-04
SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR
Executed: 2014-06-04
HADCO SANTA CLARA, INC., AS GRANTOR
Executed: 2014-06-04
SCI TECHNOLOGY, INC., AS GRANTOR
Executed: 2014-06-04
Assignee
US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
633 WEST FIFTH STREET, 24TH FLOOR, LOS ANGELES, CALIFORNIA, 90071
Covered Properties
(75)
In Situ Method for Forming a Bypass Capacitor Element Internally Within a Capacitive Pcb
Patent:
5,800,575 →
Application:
08/147,671 →
Annular Circuit Components Coupled with Printed Circuit Board Through-Hole
Patent:
5,603,847 →
Application:
08/220,540 →
Annular Circuit Components Coupled with Printed Circuit Board Through-Hole
Patent:
5,708,569 →
Application:
08/677,610 →
A Capacitive Pcb with Internal Capacitive Laminate
Patent:
5,870,274 →
Application:
08/880,661 →
Method and Apparatus for Forming Plugs in Vias of a Circuit Board Layer
Patent:
6,276,055 →
Application:
09/159,429 →
Forming Plugs in Vias of Circuit Board Layers and Subassemblies
Patent:
6,282,782 →
Application:
09/389,308 →
Cable Restraining Bracket
Patent:
6,443,404 →
Application:
09/668,192 →
Test Socket for Ball Grib Array Electronic Module
Cooling Airflow Distribution Device
Interconnect for Electrically Connecting a Multichip Module to a Circuit Substrate and Processes for Making and Using Same
Towed Airborne Vehicle Control and Explosion Damage Assessment
Cable Dispenser and Method
Current Mode Coupler Having a Unitary Casing
Cooling Airflow Distribution Device
Apparatus for Stiffening a Circuit Board
Circuit Board Threadplate
Circuit Board Standoff
Laser Trimming of Annular Passive Components
Cooling Airflow Distribution Device
Authentication Device, System and Methods
Method for Optimizing High Frequency Performance of via Structures
Electrical Cable Strain Relief and Electrical Closure
Laser Trimming of Resistors
Cooling Airflow Distribution Device
Mounting Power Handling Components on Printed Circuit Boards Near High Density Routing Channels
Disk Drive Backplane Capable of Supporting Multiple Disk Drive Carrier Designs
Interconnect for Electrically Connecting a Multichip Module to a Circuit Substrate and Processes for Making and Using Same
Stackable Electronic Assembly
Temperature-Controlled Flexible Optical Circuit for Use in an Erbium-Doped Fiber Amplifier and Method for Fabricating the Flexible Optical Circuit
Interposer Device
Non-Inverting Cross-Gain Modulation-Based Wavelength Converter
Systems and Methods for Optical Pumping Using Depolarizing Filters
Temperature Control in an Optical Amplification System
Laser Trimming of Resistors
Reconfigurable Backplane Power Distribution
Capacity-expanding memory device
Application:
11/142,989 →
Publication:
US 2006/0277355
Cooling Airflow Distribution Device
Laser Trimming of Resistors
Via Stub Termination Structures and Methods for Making Same
Global Rack System
Inline System for Collecting Stage-by-Stage Manufacturing Metrics
Method and Process for Embedding Electrically Conductive Elements in a Dielectric Layer
Substantially Continuous Layer of Embedded Transient Protection for Printed Circuit Boards
Selective Deposition of Embedded Transient Protection for Printed Circuit Boards
Self-Tuning Radio Frequency Identification Antenna System
Enhanced Localized Distributive Capacitance for Circuit Boards
Heat Sink Mounting Systems and Methods
Systems and Methods for Base Station Enclosures
Printed Circuit Board Engagement Systems and Methods
Embedded Capacitive Stack
Embedded Capacitive Stack
Simultaneous and Selective Partitioning of via Structures Using Plating Resist
Substantially Continuous Layer of Embedded Transient Protection for Printed Circuit Boards
Global Rack System
Simultaneous and Selective Partitioning of via Structures Using Plating Resist
Battery-Less Cache Memory Module with Integrated Backup
Rack System
Stackable Electronic Assembly
Patent:
42,363 →
Application:
12/557,643 →
Multi-Use Removable Electronic Data Storage Device Carrier Module
Systems and Methods for Tracking Insertion and Removal Cycles of Optical Transceiver Modules
Method and Apparatus for Supporting Storage Modules in Standard Memory and/or Hybrid Memory Bus Architectures
Circuit Board with Radio Frequency Identification for Collecting Stage-by-Stage Manufacturing Metrics
Memory Bus Architecture for Concurrently Supporting Volatile and Non-Volatile Memory Modules
Memory Controller Supporting Concurrent Volatile and Nonvolatile Memory Modules in a Memory Bus Architecture
Radio Frequency Identification for Collecting Stage-by-Stage Manufacturing and/or Post-Manufacturing Information Associated with a Circuit Board
Memory Bus Architecture for Concurrently Supporting Volatile and Non-Volatile Memory Modules
Gas Avalanche Neutron Detector
Patent:
8,975,593 →
Application:
13/612,356 →
Printed Circuit Boards with Embedded Electro-Optical Passive Element for Higher Bandwidth Transmission
Battery-Less Cache Memory Module with Integrated Backup
Fast Startup Hybrid Memory Module
Insertion and Removal Assembly for Installing and Removing Data Storage Drives in an Enclosure
Side Loading Enclosure for a Rack Mount Type Storage Unit
Structural Member for a Rack
Patent:
639,585 →
Application:
29/340,383 →
Structural Member for a Rack
Patent:
639,586 →
Application:
29/384,171 →
Structural member for a rack
Patent:
639,587 →
Application:
29/384,174 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Feb 17, 2017
From: SANMINA-SCI CORPORATION; SANMINA CORPORATION
To: SANMINA CORPORATION
Reel/Frame 041290/0729 →
Corrective Assignment to Correct the Name of the 2ND Assignor to Scott Brian Beardsley and the Name of the Assignee to Fci Americas Technology, Inc Previously Recorded on Reel 012681 Frame 0234. Assignor(S) Hereby Confirms the Assignment to Fci Americas Technology, Inc.
Mar 6, 2017
From: ADAMS, CHRISTOPHER SCOTT; BEARDSLEY, SCOTT BRIAN
To: FCI AMERICAS TECHNOLOGY, INC.
Reel/Frame 041895/0696 →
Release of Security Interest
Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →