IP Library Granted Patent US 6,923,691
Granted Patent B2
US 6,923,691 · App. 10/264,368 · Granted Aug 2, 2005

Circuit board standoff

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Quick Facts
Patent No.
US 6,923,691
App. No.
10/264,368
Granted
Aug 2, 2005
Kind
B2
Abstract

A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required electronic components.

Claims (22)

1. A circuit board standoff comprising:

a hollow substantially cylindrical member having an elongated middle section, a top section, and a bottom section;

a flange extending from the bottom section to provide a substantially flat bottom surface suitable for soldering onto a surface of a circuit board;

an opening positioned in the top section of the substantially cylindrical member and operable to receive a fastener; and

a tab extending from a section of the bottom surface of the flange, the tab suitable for insertion into an opening in the circuit board.

2. The standoff of claim 1 , wherein the tab is operable to be soldered to an underside of the circuit board.

3. The standoff of claim 1 , wherein the tab is operable to be folded to lie in a position substantially parallel to an underside of the circuit board.

4. The standoff of claim 1 , wherein the substantially flat bottom surface of the flange includes an area that has been tinned.

5. The standoff of claim 4 , wherein the substantially flat bottom surface of the flange includes an area that has been tinned with a layer of tin.

6. The standoff of claim 4 , wherein the substantially flat bottom surface of the flange includes an area that has been tinned with a layer of tin/lead alloy.

7. The standoff of claim 4 , wherein the substantially flat bottom surface of the flange includes an area that has been tinned with a layer of solder.

8. The standoff of claim 1 , wherein the elongated middle section is suitable for grasping by a SMT placement machine.

9. The standoff of claim 1 further comprising a high temperature adhesive tape affixed to the opening in the top section of the substantially cylindrical member, thus enabling the standoff to be grasped by a vacuum nozzle affixed to a SMT placement machine.

10. The standoff of claim 1 further comprising a neck extending from the top section, the neck having a diameter smaller than a diameter of the substantially cylindrical member, the neck having the opening to receive a fastener.

11. The standoff of claim 10 , wherein an inside surface of the neck is threaded to receive a screw-like fastener.

12. The standoff of claim 10 , wherein the neck protrudes inside the hollow substantially cylindrical member.

13. The standoff of claim 1 further comprising a tab extending from the top section, the tab suitable for insertion into a hole in a second circuit board, the tab operable to be folded to fasten the second circuit board.

14. The standoff of claim 1 , wherein the top section has a substantially horizontal surface sufficient to receive a section of an underside of a second circuit board.

15. The standoff of claim 1 , wherein the standoff is made from cold rolled steel.

16. The standoff of claim 1 , wherein the standoff is suitable for manufacture via a stamping process.

17. The standoff of claim 1 , wherein the fastener is a rivet.

18. The standoff of claim 1 , wherein the fastener is a screw.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY; SENSORWISE, INC.
Reel/Frame 049378/0927 →
SECURITY INTEREST Recorded Jun 5, 2014
From: SANMINA CORPORATION, AS GRANTOR; SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR; HADCO SANTA CLARA, INC., AS GRANTOR; SCI TECHNOLOGY, INC., AS GRANTOR
To: US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 033094/0826 →