IP Library Granted Patent US 7,329,831
Granted Patent B2
US 7,329,831 · App. 11/094,003 · Granted Feb 12, 2008

Laser trimming of resistors

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Quick Facts
Patent No.
US 7,329,831
App. No.
11/094,003
Granted
Feb 12, 2008
Kind
B2
Abstract

Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

Claims (29)

1. A system for laser trimming annular resistors printed on a circuit board, the system comprising:

a tester having means for measuring a resistance value for each annular resistor;

a trim application having:

means for sorting the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor; and

means for assigning a laser trim file to each bin based on a predictive trim formulation to conform each annular resistor with their respective target value; and

a laser drill having means for trimming the annular resistors within each bin in accordance with the laser trim file assigned to that bin, each laser trim file defining a set of configuration parameters for the laser drill.

2. The system of claim 1 , wherein the configuration parameters defined by the laser trim file include at least a spot size and power level for the laser drill.

3. The system of claim 1 , wherein the laser trim file further defines a drill pattern on the annular resistor to form a planar channel within the annular resistor.

4. The system of claim 3 , wherein the laser drill file includes at least a step size, an overlap factor and number of revolutions around the annular resistor to form the planar channel.

5. The system of claim 1 , wherein the tester further includes means for measuring a resistance value of each trimmed annular resistor associated with a particular bin.

6. The system of claim 5 , wherein the laser trim application further includes means for adjusting the laser trim file associated with the particular bin based on a distribution of the measured resistance values of the trimmed annular resistors within the particular bin.

7. The system of claim 5 , wherein the laser trim application further includes means for displaying a distribution of the trimmed resistance values to assess performance of the laser drill file associated with the particular bin.

8. The system of claim 1 , wherein the laser trim application further includes means for displaying a distribution of the measured resistance values associated with each bin to assess performance of an underlying screen printing process.

9. A method for laser trimming resistors, the method comprising:

a step of measuring a resistance value for each resistor of a set of resistors on a circuit substrate layer;

a step of sorting the resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor;

a step of assigning a laser trim file to each bin based on a predictive trim formulation, each laser trim file defining a set of configuration parameters for a laser drill to conform each resistor with their respective target value; and

a step of using the laser drill to trim the resistors within each bin in accordance with the laser trim file assigned to that bin;

wherein the laser trim file further defines a drill pattern on the resistor to form a planar channel within the resistor.

10. The method of claim 9 , wherein the configuration parameters defined by the laser trim file include at least a spot size and power level for the laser drill.

11. The method of claim 9 , wherein the resistors comprise annular resistors.

12. The method of claim 11 , wherein the laser trim file includes at least a step size, an overlap factor and number of feed steps over the resistor to form the planar channel.

13. A computer program product comprising:

a computer usable medium having computer readable program code embodied therein, the computer readable program code comprising:

means for receiving a resistance value for each resistor of a set of resistors on a circuit substrate layer;

means for sorting the resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor;

means for assigning a laser trim file to each bin based on a predictive trim formulation, each laser trim file defining a set of configuration parameters for a laser drill to conform each resistor with their respective target value; and

means for outputting, for uploading to the laser drill, a file having assignment of the respective resistors to respective laser trim files.

14. The computer program product of claim 13 , further comprising means for displaying a distribution of the measured resistance values associated with each bin to assess performance of an underlying passive component formation process.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY; SENSORWISE, INC.
Reel/Frame 049378/0927 →
SECURITY INTEREST Recorded Jun 5, 2014
From: SANMINA CORPORATION, AS GRANTOR; SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR; HADCO SANTA CLARA, INC., AS GRANTOR; SCI TECHNOLOGY, INC., AS GRANTOR
To: US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 033094/0826 →