Substantially continuous layer of embedded transient protection for printed circuit boards
View Patent ↗The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.
1. A method for making a core layer structure for use in PCB manufacturing, the method comprising:
using a first layer of conductive foil;
coating a layer of transient protection material on one surface of the conductive foil;
using one or more layers of B-stage dielectric material to bond said coated first layer of conductive foil on one surface of said one or more layers of B-stage dielectric material with a second layer of conductive foil on the opposing surface.
2. The method as recited in claim 1 , wherein said transient protection material behaves in a bi-directional manner for clamping both positive and negative transients of at least one of current and voltage.
3. The method as recited in claim 1 , further comprising:
bonding said coated conductive foil to at least one surface of a layer of dielectric material to form said core layer structure, wherein said layer of dielectric material is un-reinforced film.
4. The method as recited in claim 1 , further comprising:
bonding said coated conductive foil to at least one surface of a layer of dielectric material to form said core layer structure, wherein said layer of dielectric material is reinforced with fiberglass material of varying composition.
5. A method for making a core layer structure for use in PCB manufacturing, the method comprising:
using a layer of conductive material, said layer of conductive material having a top surface and a bottom surface; and
coating a layer of transient protection material on one of said top surface and said bottom surface.
6. The method as recited in claim 5 , further comprising bonding said coated conductive material to at least one surface of a layer of dielectric material to form said core layer structure.
7. The method as recited in claim 6 , wherein said layer of dielectric material is any one of: epoxy, polyimide, teflon and any nonconducting polymer.
8. The method as recited in claim 6 , wherein said layer of dielectric material is un-reinforced film.
9. The method as recited in claim 6 , wherein said layer of dielectric material is reinforced with fiberglass material of varying composition.
10. The method as recited in claim 6 , wherein said layer of dielectric material is reinforced with random fibers of various compositions.
11. The method as recited in claim 6 , further comprising laminating said core layer structure to a PCB stackup.
12. The method as recited in claim 5 , wherein said layer of conductive material is coated with a resin.
13. The method as recited in claim 12 , wherein said resin is any one of a polyimide and an epoxy polymer.
14. The method as recited in claim 5 , wherein exposed areas of said layer of transient protection material is removed by mechanical methods.
15. The method as recited in claim 5 , wherein said transient protection material behaves in a bi-directional manner for clamping both positive and negative transients of at least one of current and voltage.
16. A method for making a printed circuit board with integrated transient protection, the method comprising:
making said printed circuit board using multiple layers including at least one signal area, and at least one reference plane; and
making said at least one reference plane using transient protection material and at least one layer of conductive material.
17. The method as recited in claim 16 , wherein said transient protection material behaves in a bi-directional manner for clamping both positive and negative transients of at least one of current and voltage.
18. The method as recited in claim 16 , further comprising:
bonding said at least one reference plane to at least one surface of a layer of dielectric material, wherein said layer of dielectric material is un-reinforced film.
19. The method as recited in claim 16 , further comprising:
bonding said at least one reference plane to at least one surface of a layer of dielectric material, wherein said layer of dielectric material is reinforced with fiberglass material of varying composition.