Patent Assignment
Reel/Frame 073363/0212
Security Interest
Recorded: 2025-10-28
Pages: 13
Assignor
SANMINA CORPORATION
Executed: 2025-10-27
Assignee
BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
900 W TRADE ST, GATEWAY VILLAGE-900 BUILDING, NC1-026-06-09 (MACLEGAL), CHARLOTTE, NORTH CAROLINA, 28255
Covered Properties
(102)
Data Storage Housing with a Set of Hard Drives and Fan Devices
Cable Management Perch for Use with Rack Rail-Mounted Chassis
Method of Forming a Laminate Structure Having a Plated Through-Hole Using a Removable Cover Layer
Dis-Aggregated Switching and Protocol Configurable Input/Output Module
Data Storage Cooling Module
Open-Axis Optical Rotary Joint
Acoustic Attenuation Device
Expendable Airborne Fiber Optic Link
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
Modular Motherboard for a Computer System and Method Thereof
Methods of Forming High Aspect Ratio Plated Through Holes and High Precision Stub Removal in a Printed Circuit Board
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
Method and Apparatus for Consistent and Highly Available Data Storage Using Local and Fabric Attached Non-Volatile Memory Storage Devices
Laminate Structures with Hole Plugs and Methods of Forming Laminate Structures with Hole Plugs
Modular Non-Volatile Memory Express Storage Appliance and Method Therefor
Patent:
11,086,813 →
Application:
15/997,686 →
Devices and Methods for Facilitating Blast and Dispersion Mitigation
Methods of Manufacturing Ultra Thin Dielectric Printed Circuit Boards with Thin Laminates
Devices and Methods for Facilitating Capture of Unmanned Aerial Vehicles
Delay Circuitry to Hold Up Power to a Mass Storage Device and Method Therefor
Tilt-Rotor Multicopters with Variable Pitch Propellers
Heating Element and Circuit Managing Equivalent Series Resistance of Energy Storage Cell
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
Multilayer Printed Circuit Board via Hole Registration and Accuracy
Method of Forming a Laminate Structure Having a Plated Through-Hole Using a Removable Cover Layer
Dual Inline Memory Module
Drive Carrier and Method Therefor
Devices and Methods for Facilitating Blast and Dispersion Mitigation
Multilayer Printed Circuit Board via Hole Registration and Accuracy
Nets and Devices for Facilitating Capture of Unmanned Aerial Vehicles
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
PERIPHERAL COMPONENT INTERCONNECT EXPRESS (PCIe) SOLID STATE DRIVE (SSD) ACCELERATOR
Method of Flow Based Services for Flash Storage
Patent:
10,313,236 →
Application:
14/321,262 →
Apparatuses and Methods for Cooling High Density Arrays of Non-Volatile Memory Mass Storage Devices
Patent:
10,251,315 →
Application:
15/959,127 →
Method for Forming Hole Plug
Methods of Forming Blind Vias for Printed Circuit Boards
Non-Volatile Dual in-Line Memory Module (Nvdimm) Multichip Package
Methods of Forming High Aspect Ratio Plated Through Holes and High Precision Stub Removal in a Printed Circuit Board
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
Multiple Protocol Engine Transaction Processing
Storage System with Flow Based Services for Flash Storage
Patent:
9,973,424 →
Application:
14/321,218 →
Network System with Cache Offload Service for Flash Storage
Patent:
9,940,241 →
Application:
14/552,400 →
Cable Management Assembly for Rack Mounted Equipment
Base Board Architecture for a Server Computer and Method Therefor
Network Storage System Using Flash Storage
Network System to Distribute Chunks Across Multiple Physical Nodes with Disk Support for Object Storage
Patent:
9,852,151 →
Application:
14/552,387 →
High Availability Management Techniques for Cluster Resources
Patent:
9,817,721 →
Application:
14/552,376 →
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
Simultaneous and Selective Wide Gap Partitioning of via Structures Using Plating Resist
System and Method for Cache Data Recovery
Patent:
9,715,428 →
Application:
14/552,355 →
Network System to Distribute Chunks Across Multiple Physical Nodes
Patent:
9,697,226 →
Application:
13/967,289 →
Apparatus and Method for Visual Field Replaceable Unit Identification in the Absence of Host System Device Power
Cache Memory Management System and Method
Patent:
9,672,180 →
Application:
14/552,329 →
Methods of Segmented Through Hole Formation Using Dual Diameter Through Hole Edge Trimming
Network System with Offload Services for Flash Storage
Patent:
9,608,936 →
Application:
14/552,393 →
Method of Configuring a System for Flow Based Services for Flash Storage and Associated Information Structure
Patent:
9,509,604 →
Application:
14/321,317 →
Printed Circuit Boards with Embedded Electro-Optical Passive Element for Higher Bandwidth Transmission
Side Loading Enclosure for a Rack Mount Type Storage Unit
Battery-Less Cache Memory Module with Integrated Backup
Method and Apparatus for Supporting Storage Modules in Standard Memory and/or Hybrid Memory Bus Architectures
System and Method for Cache Entry Aging
Patent:
9,384,147 →
Application:
14/552,344 →
Retaining Clip for Use with a Mass Storage Device
Network Storage System Using Flash Storage
Method for Forming Interposers and Stacked Memory Devices
Flash-Based Storage System Including Reconfigurable Circuitry
Embedded Capacitive Stack
Memory Controller Supporting Concurrent Volatile and Nonvolatile Memory Modules in a Memory Bus Architecture
Insertion and Removal Assembly for Installing and Removing Data Storage Drives in an Enclosure
Fast Startup Hybrid Memory Module
Method for Forming Interposers and Stacked Memory Devices
Memory Device with Die Stacking and Heat Dissipation
Patent:
9,013,040 →
Application:
14/045,226 →
Method for Efficiently Retrieving Topology-Specific Data for Point-to-Point Networks
Embedded Capacitive Stack
Simultaneous and Selective Partitioning of via Structures Using Plating Resist
Memory Bus Architecture for Concurrently Supporting Volatile and Non-Volatile Memory Modules
Memory Bus Architecture for Concurrently Supporting Volatile and Non-Volatile Memory Modules
Radio Frequency Identification for Collecting Stage-by-Stage Manufacturing and/or Post-Manufacturing Information Associated with a Circuit Board
Battery-Less Cache Memory Module with Integrated Backup
Multi-Use Removable Electronic Data Storage Device Carrier Module
Simultaneous and Selective Partitioning of via Structures Using Plating Resist
Circuit Board with Radio Frequency Identification for Collecting Stage-by-Stage Manufacturing Metrics
Transaction Processing Using Multiple Protocol Engines in Systems Having Multiple Multi-Processor Clusters
Substantially Continuous Layer of Embedded Transient Protection for Printed Circuit Boards
Enhanced Localized Distributive Capacitance for Circuit Boards
Inline System for Collecting Stage-by-Stage Manufacturing Metrics
Method for Facilitating Unification of Event Framework Views and System Comprising Same
Substantially Continuous Layer of Embedded Transient Protection for Printed Circuit Boards
Method and Process for Embedding Electrically Conductive Elements in a Dielectric Layer
Selective Deposition of Embedded Transient Protection for Printed Circuit Boards
Self-Tuning Radio Frequency Identification Antenna System
Printed Circuit Board Engagement Systems and Methods
Via Stub Termination Structures and Methods for Making Same
Bandwidth, Framing and Error Detection in Communications Between Multi-Processor Clusters of Multi-Cluster Computer Systems
Structural Member for a Rack
Patent:
928,346 →
Application:
29/705,988 →
Structural Member
Patent:
744,317 →
Application:
29/448,240 →
Enhanced Fan Integration in Data Storage Systems
Dis-Aggregated Switching and Protocol Configurable Input/Output Module
Application:
18/895,065 →
Publication:
US US20250016118A1
Bezel-Mounted Acoustic Filter for Use with Rack Rail-Mounted Chassis
Application:
17/985,030 →
Publication:
US US20240164050A1
System for Sensing the Position of a Movable Electrical Contact
Method of Forming High Aspect Ratio Plated Through Holes
Ultra Thin Dielectric Printed Circuit Boards with Thin Laminates and Method of Manufacturing Thereof
Embedded Wilkinson Power Divider with Resistive Foil Within Multi-Layer Printed Circuit Board
Application:
18/673,053 →
Publication:
US US20250316878A1
Drive Carrier for Data Storage Systems
Application:
19/175,849 →
Publication:
US US20250324530A1
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 9, 2018
From: SCHUETTE, FRANZ MICHAEL; GALE, DANIEL M.; HILL, CHARLES C.; BOWMAN, MATTHEW T.
To: SANMINA CORPORATION
Reel/Frame 046297/0287 →
Assignment of Assignor's Interest
Jul 18, 2018
From: IKETANI, SHINICHI; SUZUKI, TOSHIYA
To: SANMINA CORPORATION
Reel/Frame 046387/0995 →
Security Interest
Aug 3, 2018
From: SANMINA CORPORATION
To: U.S. BANK NATIONAL ASSOCIATION, NOT IN ITS INDIVIDUAL CAPACITY BUT SOLELY AS NOTES COLLATERAL AGENT
Reel/Frame 046797/0063 →
Assignment of Assignor's Interest
Aug 13, 2018
From: HILL, CHARLES C.; SCHUETTE, FRANZ MICHAEL
To: SANMINA CORPORATION
Reel/Frame 046632/0067 →
Security Interest
Oct 22, 2018
From: SANMINA CORPORATION
To: U.S. BANK NATIONAL ASSOCIATION, NOT IN ITS INDIVIDUAL CAPACITY BUT SOLELY AS NOTES COLLATERAL AGENT
Reel/Frame 047261/0572 →
Assignment of Assignor's Interest
Jan 22, 2019
From: THOMAS, DOUGLAS WARD; IKETANI, SHINICHI; KERSTEN, DALE
To: SANMINA CORPORATION
Reel/Frame 048093/0226 →
Statement of Ownership
Mar 11, 2019
From: KERSTEN, DALE
To: SANMINA CORPORATION
Reel/Frame 048567/0638 →
Assignment of Assignor's Interest
Mar 11, 2019
From: IKETANI, SHINICHI
To: SANMINA CORPORATION
Reel/Frame 048565/0762 →
Release of Security Interest
Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →
Assignment of Assignor's Interest
Feb 20, 2020
From: BELGAIED, KAIS; ELLING, RICHARD; SCHUETTE, FRANZ MICHAEL
To: SANMINA CORPORATION
Reel/Frame 051882/0558 →
Assignment of Assignor's Interest
Apr 10, 2020
From: KLEIN, MAX EDWARD
To: SANMINA CORPORATION
Reel/Frame 052368/0455 →
Assignment of Assignor's Interest
Aug 5, 2020
From: IKETANI, SHINICHI; KERSTEN, DALE; DUDNIKOV, GEORGE, JR
To: SANMINA CORPORATION
Reel/Frame 053411/0953 →
Assignment of Assignor's Interest
Sep 1, 2020
From: IKETANI, SHINICHI; KERSTEN, DALE
To: SANMINA CORPORATION
Reel/Frame 053660/0138 →
Assignment of Assignor's Interest
May 21, 2021
From: IKETANI, SHINICHI; DOBLAR, DREW
To: SANMINA CORPORATION
Reel/Frame 056319/0073 →
Assignment of Assignor's Interest
Oct 29, 2021
From: KLEIN, MAX EDWARD; PORTER, DAVID; CASTLEBERRY, WALTER THOMAS
To: SANMINA CORPORATION
Reel/Frame 057964/0680 →
Assignment of Assignor's Interest
Oct 29, 2021
From: KILLEN, ODIE BANKS, JR.; HILL, CHARLES C.; KUMAR, RITESH
To: SANMINA CORPORATION
Reel/Frame 057967/0271 →
Assignment of Assignor's Interest
Jan 18, 2022
From: KILLEN, ODIE BANKS, JR.; BABCOCK, MATTHEW J.; RUGGLES, BRENDAN
To: SANMINA CORPORATION
Reel/Frame 058685/0074 →
Assignment of Assignor's Interest
Feb 21, 2022
From: KILLEN, ODIE BANKS, JR.; HOLWAY, BRADLEY S.; BABCOCK, MATTHEW J.
To: SANMINA CORPORATION
Reel/Frame 059059/0578 →
Assignment of Assignor's Interest
Apr 6, 2022
From: DUGAN, JOHN MICHAEL; PASTOR, CURTIS; ALT, MARK
To: SANMINA CORPORATION
Reel/Frame 059522/0396 →
Assignment of Assignor's Interest
Dec 2, 2022
From: KILLEN, JR., ODIE BANKS; BAUER, JR., JOHN ALBERT
To: SANMINA CORPORATION
Reel/Frame 061958/0815 →
Assignment of Assignor's Interest
Nov 27, 2023
From: KILLEN, JR., ODIE BANKS; HOLWAY, BRADLEY S.; BABCOCK, MATTHEW J.
To: SANMINA CORPORATION
Reel/Frame 065669/0922 →