Laminate structures with hole plugs and methods of forming laminate structures with hole plugs
Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.
1. A method for forming a hole plug, comprising:
forming a laminate structure including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer, the dielectric layer including a second side opposite from the first side by a thickness of the dielectric layer;
forming a blind hole with a bottom surface, a sidewall substantially transverse to the bottom surface, and a trimmed bottom corner in the laminate structure, the blind hole extending through the dielectric layer toward the first conductive foil from the second side of the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1);
disposing via fill ink in the blind hole; and
drying and/or curing the via fill ink to form a hole plug.
2. The method of claim 1 , further comprising:
forming the laminate structure to further include a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is pierced by the blind hole.
3. The method of claim 1 , further comprising:
incorporating the laminate structure into a multilayer printed circuit board.
4. The method of claim 1 , further comprising:
forming a plated through hole through the hole plug.
5. The method of claim 1 , wherein forming the blind hole with the trimmed bottom corner comprises:
forming the blind hole with a drill having a point angle equal or greater than: (a) 125 degrees, or (b) 155 degrees.
6. The method of claim 1 , wherein depositing the via fill ink comprises depositing the via fill ink with vacuum assistance.
7. The method of claim 1 , wherein the first conductive foil has a thickness of 12 ounce or less, 2 ounce or less, or 1 ounce or less.
8. The method of claim 1 , wherein the dielectric layer has a thickness of 20 mil or less, 16 mil or less, or 12 mil or less.
9. The method of claim 1 , wherein the via fill ink comprises a plating resist or a material that prevents metal plating.
10. A laminate structure, comprising:
a dielectric layer including a first side and an opposing second side separate from the first side by a thickness of the dielectric layer;
a first conductive foil disposed on the first side of the dielectric layer;
a blind hole in the dielectric layer extending through the dielectric layer from the second side of the dielectric layer toward the first conductive foil without piercing the first conductive foil, the bind hole including a bottom surface, a sidewall substantially transverse to the bottom surface, and a trimmed bottom corner and a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1); and
via fill ink disposed in the blind hole to form a hole plug.
11. The laminate structure of claim 10 , further comprising:
a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is pierced by the blind hole.
12. The laminate structure of claim 10 , further comprising:
a plated through hole through the hole plugged material.
13. The laminate structure of claim 10 , wherein the trimmed bottom corner of the blind hole comprises a point angle equal or greater than: (a) 125 degrees, or (b) 155 degrees.
14. A multilayer printed circuit board comprising the laminate structure of claim 10 .