Method for forming hole plug
A method for forming a hole plug in a laminate structure is provided. A laminate structure, is formed, including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1). In yet another example, the hole aspect ratio may be less than one (1) to one (1). Via fill ink may then be deposited in the hole. The via fill ink is then dried and/or cured to form a hole plug.
1. A method for forming a hole plug, comprising:
forming a laminate structure including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer, the dielectric layer including a second side separate from the first side by a thickness of the dielectric layer;
forming a blind hole in the laminate structure with a drill having a point angle greater than 125 degrees, the blind hole extending toward the first conductive foil from the second side of the dielectric layer, the blind hole extending through the dielectric layer a threshold distance of the thickness of the dielectric layer, the blind hole having a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1);
depositing via fill ink in the blind hole; and
drying or curing the via fill ink to form a hole plug.
2. The method of claim 1 , further comprising:
forming the laminate structure to further include a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is pierced by the blind hole.
3. The method of claim 2 , further comprising:
forming the laminate structure to further include a disposable layer on the second conductive foil.
4. The method of claim 1 , further comprising:
using a depth sensor to determine the threshold distance.
5. The method of claim 1 , further comprising:
determining the hole depth of the blind hole;
determining the hole diameter of the blind hole; and
determining the hole diameter aspect ratio based at least in part on the hole depth and the hole diameter.
6. The method of claim 1 , further comprising:
determining the hole diameter aspect ratio meets a threshold hole diameter aspect ratio before depositing the via fill ink in the blind hole.
7. The method of claim 1 , wherein forming the blind hole in the laminate structure with a drill having a point angle greater than 125 degrees comprises:
forming the blind hole in the laminate structure with a drill having a point angle of at least 155 degrees.
8. The method of claim 1 , further comprising:
determining via fill ink that satisfies at least one via fill ink property, wherein depositing the via fill ink includes utilizing the determined via fill ink.
9. The method of claim 1 , further comprising:
depositing the via fill ink using one of a screen printing technique, a stencil printing technique, or by squeezing the via fill ink into the blind hole.
10. A method, comprising:
forming a laminate structure that includes a dielectric layer and a conductive foil on a first side of the dielectric layer, the dielectric layer including a second side separate from the first side by a thickness of the dielectric layer; and
forming a blind hole in the laminate structure with a drill having a point angle greater than 125 degrees, the blind hole extending toward the conductive foil from the second side of the dielectric layer, the blind hole extending through the dielectric layer a threshold distance of the thickness of the dielectric layer.
11. The method of claim 10 , comprising:
depositing via fill ink in the blind hole; and
forming a hole plug by curing the via fill ink.
12. The method of claim 11 , further comprising:
using a vacuuming technique to deposit the via fill ink.
13. The method of claim 11 , further comprising:
determining via fill ink that satisfies at least one via fill ink property, wherein depositing the via fill ink includes utilizing the determined via fill ink.
14. The method of claim 13 , wherein the via fill ink property includes at least one of a viscosity property or a thixotropic property.
15. The method of claim 14 , wherein the thixotropic property includes a ratio of a static viscosity to a dynamic viscosity that satisfies a threshold thixotropic ratio.
16. The method of claim 10 , further comprising:
masking and etching a second conductive foil to form an opening on the second conductive foil.
17. The method of claim 16 , wherein forming the blind hole in the laminate structure with a drill having a point angle greater than 125 degrees comprises:
forming the blind hole in the laminate structure with a drill having a point angle of at least 155 degrees.
18. A laminate structure, comprising:
a dielectric layer, the dielectric layer having a conductive foil on a first side, a blind hole extending toward a first conductive foil from a second side of the dielectric layer, the blind hole shaped by a drill having a point angle greater than 125 degrees and extending through the dielectric layer a threshold distance of a thickness of the dielectric layer.
19. The laminate structure of claim 18 , wherein the blind hole is associated with a hole depth and a hole diameter, a ratio of the hole depth to hole diameter satisfying a threshold hole diameter aspect ratio.
20. The laminate structure of claim 18 , wherein the dielectric layer includes a through-hole through the via fill ink, wherein the blind hole is associated with a first diameter and the through-hole is associated with a second diameter, the second diameter being less than the first diameter.