IP Library Assignment 046387/0995
Patent Assignment
Reel/Frame 046387/0995

Assignment of Assignor's Interest

Recorded: 2018-07-18 Pages: 3
Assignors
IKETANI, SHINICHI
Executed: 2018-03-01
SUZUKI, TOSHIYA
Executed: 2018-03-20
Assignee
SANMINA CORPORATION
2700 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Methods of Manufacturing Ultra Thin Dielectric Printed Circuit Boards with Thin Laminates
Application: 16/036,913 →
Publication: US US20190021177A1
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 22, 2018
From: SANMINA CORPORATION
To: U.S. BANK NATIONAL ASSOCIATION, NOT IN ITS INDIVIDUAL CAPACITY BUT SOLELY AS NOTES COLLATERAL AGENT
Reel/Frame 047261/0572 →
Release of Security Interest Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →
Security Interest Oct 28, 2025
From: SANMINA CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 073363/0212 →