Method of forming a laminate structure having a plated through-hole using a removable cover layer
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
1. A core or sub-composite structure, comprising:
a first conductive film including a peelable first cover layer formed on or coupled to a first surface of a first conductive layer, wherein the first cover layer is less than 20 microns thick;
a dielectric layer coupled to a second surface of the first conductive layer of the first conductive film, wherein the first conductive layer is thinner than the dielectric layer;
a hole formed through the first cover layer, the first conductive layer, and the dielectric layer; and
a plating resist disposed in the hole, and over at least a portion of the first cover layer.
2. The core or sub-composite structure of claim 1 , further comprising:
a second conductive film including a second peelable/removable cover layer formed on or coupled to a first surface of a second conductive layer, wherein the dielectric layer is coupled to a second surface of the second conductive layer of the second conductive film.
3. The core or sub-composite structure of claim 2 , wherein the first and second cover layers are one of a: metallic foil or organic film.
4. The core or sub-composite structure of claim 2 , wherein the first and second cover layer are polymer layers.
5. The laminated structure of claim 2 , wherein the second cover layer is formed of a thermoplastic resin that has a 120 degree Celsius or higher melting point temperature.
6. The core or sub-composite structure of claim 1 , wherein the first conductive layer has a thickness of between 3 microns and 210 microns.
7. The core or sub-composite structure of claim 1 , wherein the first conductive layer has a thickness of between 12 microns and 35 microns.
8. The core or sub-composite structure of claim 1 , wherein the first conductive layer is formed on the dielectric layer and the first cover layer is then coupled to the first conductive layer.
9. The core or sub-composite structure of claim 1 , wherein the first conductive layer and first cover layer are coupled together and then they are coupled to the dielectric layer.
10. The core or sub-composite structure of claim 1 , wherein the core or sub-composite structure has a total thickness of 250 thousands of an inch (mil) or less.
11. The core or sub-composite structure of claim 1 , wherein the dielectric layer consists of one of a: epoxy, polyimide, polyphenylene ether (PPO), cyanate ester, hydrocarbon, polytetrafluoroethylene (PTFE), bismaleimide triazine (BT), phenol resin or a blend of these resins.
12. The core or sub-composite structure of claim 1 , wherein the first cover layer is a metallic foil coupled to the first conductive layer.
13. The laminated structure of claim 1 , wherein the first cover layer is a metallic layer.
14. The laminated structure of claim 1 , wherein the first cover layer is formed of a thermoplastic resin that has a 120 degree Celsius or higher melting point temperature.
15. The laminated structure of claim 1 , wherein the first cover layer is formed of a thermosetting plastic.