Methods of forming blind vias for printed circuit boards
A multilayer PCB having may include a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric and conductive layers. A first via hole extends at least partially through the first core structure, wherein an inner surface of the first via hole is plated with a conductive material along a first via segment electrically coupling the first conductive layer to an internal layer or trace within the first core structure. A second via segment extending between the second conductive layer and the internal layer or trace is devoid of the conductive material such that the first via hole is substantially stub free. A first dielectric layer is coupled to the second conductive layer. A second sub-composite core coupled to the first dielectric layer.
1. A printed circuit board (PCB) having a blind plated through hole, the PCB manufactured by a method comprising:
forming a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric layers and conductive layers;
forming a first via hole through the first core structure;
plating an inner surface of the first via hole with a conductive material to form a first plated via hole, wherein the first plated via hole electrically couples the first conductive layer to an internal layer or trace within the first core structure;
filling the first plated via hole with a conductive ink;
backdrilling the first plated via hole along a segment between the second conductive layer and the internal layer or trace to form a first blind plated through hole, wherein such backdrilling removes both the conductive material and conductive ink along the segment; and
laminating the second conductive layer of the first sub-composite core to a second sub-composite core.
2. The printed circuit board of claim 1 , wherein the PCB is manufactured by a method further comprising:
drilling a blind hole through the first plated via hole at least through the non-conductive ink or to the non-conductive ink.
3. The printed circuit board of claim 1 , wherein the PCB is manufactured by a method further comprising:
filling the backdrilled segment with a non-conductive ink prior to laminating.
4. The printed circuit board of claim 1 , wherein the PCB is manufactured by a method further comprising:
etching the second conductive layer to form traces prior to laminating.
5. The printed circuit board of claim 1 , wherein the second sub-composite core is formed from a second core structure sandwiched between a third conductive layer and a fourth conductive layer, the second core structure including one or more dielectric layers and conductive layers.
6. A printed circuit board (PCB), comprising:
a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric layers and conductive layers;
a first via hole through the first core structure, wherein an inner surface of the first via hole is plated with a conductive material along a first via segment electrically coupling the first conductive layer to an internal layer or trace within the first core structure, while a second via segment between the second conductive layer and the internal layer or trace is devoid of the conductive material such that the first via hole is stub free;
a first dielectric layer coupled to the second conductive layer; and
a second sub-composite core having a second core structure sandwiched between a third conductive layer and a fourth conductive layer, the second sub-composite core coupled to the first dielectric layer.
7. The printed circuit board of claim 6 , wherein the first conductive layer is also internal to the first sub-composite structure.
8. The printed circuit board of claim 6 , wherein a stub is a plated portion within the first via hole that is not coupled to a conductive layer or trace at both ends.
9. A method for making a printed circuit board (PCB) having a blind plated through hole, comprising:
forming a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric layers and conductive layers;
forming a first via hole through the first core structure;
plating an inner surface of the first via hole with a conductive material to form a first plated via hole, wherein the first plated via hole electrically couples the first conductive layer to an internal layer or trace within the first core structure;
filling the first plated via hole with a conductive ink;
backdrilling the first plated via hole along a segment between the second conductive layer and the internal layer or trace to form a first blind plated through hole, wherein such backdrilling removes both the conductive material and conductive ink along the segment; and
laminating the second conductive layer of the first sub-composite core to a second sub-composite core.
10. The method of claim 9 , further comprising:
backdrilling the first plated via hole along a second segment between the first conductive layer and a second trace, wherein such backdrilling removes both the conductive material and conductive ink along the second segment.
11. The method of claim 9 , further comprising:
drilling a blind hole through the first plated via hole at least through the non-conductive ink or to the non-conductive ink.
12. The method of claim 9 , further comprising:
filling the backdrilled segment with a non-conductive ink prior to laminating.
13. The method of claim 9 , further comprising:
etching the second conductive layer to form traces prior to laminating.
14. The method of claim 9 , wherein the second sub-composite core is formed from a second core structure sandwiched between a third conductive layer and a fourth conductive layer, the second core structure including one or more dielectric layers and conductive layers.
15. The method of claim 14 , wherein the second conductive layer of the first sub-composite core is laminated to the fourth conductive layer of the second sub-composite core.
16. The method of claim 14 , further comprising
forming a second via hole through the second core structure;
plating an inner surface of the second via hole with a conductive material to form a second plated via hole, wherein the second plated via hole electrically couples the third conductive layer to an internal layer or trace within the second core structure;
filling the second plated via hole with a conductive ink;
backdrilling the second plated via hole along a segment between the fourth conductive layer and the internal layer or trace, wherein such backdrilling removes both the conductive material and conductive ink along the segment.
17. The method of claim 16 , further comprising:
drilling a blind hole through the second plated via hole at least through non-conductive ink or to the non-conductive ink.
18. The method of claim 14 , further comprising:
etching the third conductive layer to form traces prior to lamination.