Simultaneous and selective wide gap partitioning of via structures using plating resist
View Patent ↗A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
1. A multilayer printed circuit board, comprising:
a first core or sub-composite structure;
a second core or sub-composite structure;
a first dielectric layer between the first core or sub-composite structure and a first surface of the second core or sub-composite structure;
a third core or sub-composite structure;
a second dielectric layer between the third core or sub-composite structure and a second surface of the second core or sub-composite structure;
a first plating resist selectively positioned in the first dielectric layer and adjacent to the first core or sub-composite structure;
a second plating resist selectively positioned in the first dielectric layer and adjacent to the second core or sub-composite structure, the second plating resist separate from the first plating resist;
a third plating resist selectively positioned in the second dielectric layer and adjacent to the second core or sub-composite structure;
a fourth plating resist selectively positioned in the second dielectric layer and adjacent to the third core or sub-composite structure, the third plating resist separate from the fourth plating resist; and
a through hole extending through the first core or sub-composite structure, the second core or sub-composite structure, the first dielectric layer, the first plating resist, the second plating resist, the third dielectric layer, the fourth dielectric layer, and the third core or sub-composite structure, where an interior surface of the through hole is plated with a conductive material except along a first gap between the first plating resist and the second plating resist to form a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
2. The multilayer printed circuit board of claim 1 , wherein the interior surface of the through hole is also plated with the conductive material except along a second gap between the third plating resist and the fourth plating resist to form a partitioned plated through hole having the second via segment electrically isolated from a third via segment.
3. The multilayer printed circuit board of claim 2 , wherein the first via segment extends through the first core or sub-composite structure to the first plating resist, the second via segment extends from the second plating resist through the second core or sub-composite structure and to the third plating resist, and the third via segment extends from the fourth plating resist and through the third core or sub-composite structure.
4. The multilayer printed circuit board of claim 3 , wherein the first via segment and the third via segment are electrically isolated from each other.
5. The multilayer printed circuit board of claim 3 , wherein the first via segment, the second via segment, and the third via segment are electrically isolated from each other.
6. The multilayer printed circuit board of claim 1 , wherein the first plating resist, the second plating resist, the third plating resist, and the fourth plating resist are deposited only in regions surrounding the through hole.
7. A multilayer printed circuit board, comprising:
a first core or sub-composite structure;
a second core or sub-composite structure;
a first dielectric layer between the first core or sub-composite structure and a first surface of the second core or sub-composite structure;
a third core or sub-composite structure;
a second dielectric layer between the third core or sub-composite structure and a second surface of the second core or sub-composite structure;
a first plating resist selectively positioned in the first dielectric layer and adjacent to the first core or sub-composite structure;
a second plating resist selectively positioned in the first dielectric layer and adjacent to the second core or sub-composite structure, the second plating resist separate from the first plating resist;
a third plating resist selectively positioned in the second dielectric layer and adjacent to the second core or sub-composite structure;
a fourth plating resist selectively positioned in the second dielectric layer and adjacent to the third core or sub-composite structure, the third plating resist separate from the fourth plating resist; and
a through hole extending through the first core or sub-composite structure, the second core or sub-composite structure, the first dielectric layer, the first plating resist, the second plating resist, the third dielectric layer, the fourth dielectric layer, and the third core or sub-composite structure, where an interior surface of the through hole is plated with a conductive material between the second plating resist and the third plating resist but is devoid of conductive material between the first plating resist and the second plating resist and is devoid of conductive material between the third plating resist and the fourth plating resist.
8. The multilayer printed circuit board of claim 7 , wherein the first plating resist, the second plating resist, the third plating resist, and the fourth plating resist are deposited only in regions surrounding the through hole.
9. A method for making a multilayer printed circuit board, comprising: forming a first core or sub-composite structure; forming a second core or sub-composite structure;
forming a first dielectric layer between the first core or sub-composite structure and a first surface of the second core or sub-composite structure; forming a third core or sub-composite structure;
forming a second dielectric layer between the third core or sub-composite structure and a second surface of the second core or sub-composite structure;
selectively depositing a first plating resist in the first dielectric layer and adjacent to the first core or sub-composite structure;
selectively depositing a second plating resist in the first dielectric layer and adjacent to the second core or sub-composite structure, the second plating resist separate from the first plating resist;
selectively depositing a third plating resist in the second dielectric layer and adjacent to the second core or sub-composite structure;
selectively depositing a fourth plating resist in the second dielectric layer and adjacent to the third core or sub-composite structure, the third plating resist separate from the fourth plating resist;
forming a through hole extending through the first core or sub-composite structure, the second core or sub-composite structure, the first dielectric layer, the first plating resist, the second plating resist, the third dielectric layer, the fourth dielectric layer, and the third core or sub-composite structure; and
plating an interior surface of the through hole with a conductive material except along a first gap between the first plating resist and the second plating resist to form a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
10. The method of claim 9 , wherein the interior surface of the through hole is also plated with the conductive material except along a second gap between the third plating resist and the fourth plating resist to form a partitioned plated through hole having the second via segment electrically isolated from a third via segment.
11. The method of claim 10 , wherein the first via segment extends through the first core or sub-composite structure to the first plating resist, the second via segment extends from the second plating resist through the second core or sub-composite structure and to the third plating resist, and the third via segment extends from the fourth plating resist and through the third core or sub-composite structure.
12. The method of claim 11 , wherein the first via segment and the third via segment are electrically isolated from each other.
13. The method of claim 11 , wherein the first via segment, the second via segment, and the third via segment are electrically isolated from each other.
14. The method of claim 9 , wherein the first plating resist, the second plating resist, the third plating resist, and the fourth plating resist are deposited only in regions surrounding the through hole.