IP Library › Granted Patent US 6,433,424
Granted Patent Utility
US 6,433,424 · Confirmation No. 2779

SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME WITH DIE OVERHANGING LEAD FRAME PAD

Inventor: Tim Sammon
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2016-08-09 COCOUT Certificate of Correction - Post Issue Communication 1 View
2016-07-25 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2016-07-25 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2016-07-19 PA.. Power of Attorney 2 View
2016-07-19 CFILE Request for Corrected Filing Receipt 5 View
2016-07-19 TRAN.LET Transmittal Letter 2 View
2016-07-19 N417 Electronic Filing System Acknowledgment Receipt 3 View
2016-07-19 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2016-07-19 ADS Application Data Sheet 4 View
2016-03-24 COCIN Request for Certificate of Correction 3 View
2016-03-24 TRAN.LET Transmittal Letter 1 View
2001-10-26 TRNA Transmittal of New Application 1 View
2001-10-26 ADS Application Data Sheet 1 View
2001-10-26 SPEC Specification 5 View
2001-10-26 CLM Claims 3 View
2001-10-26 ABST Abstract 1 View
2001-10-26 DRW Drawings-only black and white line drawings 2 View
2001-10-26 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,433,424
App. No.
10/002,252
Filed
2001-10-26
Granted
2002-08-13
Pub. No.
US20020047198A1
Art Unit
2815
PTA
0 days