Frame scale package using contact lines through the elements
View Patent ↗A package for an integrated circuit contacting device which is shaped like a frame. A portion of the contacting device may be bonded to the printed circuit board, and includes leads which extend along in outer surface thereof, from an outside edge of the package to a downward facing surface of the package which faces an integrated circuit die. The package may be in dented in the shape of the die, and may also include indentations allowing a lid and/or a back portion to be located thereon. In an embodiment, a lens amounts may also be used.
1. A package for a rectangular integrated circuit, comprising:
a frame defining an opening between a top surface and a bottom surface, said bottom surface including an indented area where a thickness between the top surface and the bottom surface is thinner than in a non indented area of said bottom surface, said frame being adapted to accept in said indented area an integrated circuit while preserving a portion of said opening between said indented area and said stop surface; and
a contact portion, said contact portion extending along said bottom surface within said indented area, and along said bottom surface within said non indented area, said contact portion being adapted to connect to said integrated circuit at an edge thereof.
2. A package as in claim 1 , wherein said package includes a connection portion, adapted for soldering to said integrated circuit.
3. A package as in claim 2 , wherein said integrated circuit includes an image sensor, and a central portion of said frame defines a portion where image light can enter said image sensor.
4. A package as in claim 1 , further comprising an element which allows sealing said integrated circuit relative to an environment of said package.
5. A package as in claim 3 , further comprising a clear sealing element which allows sealing said integrated circuit relative to the environment.
6. A package as in claim 5 , wherein said clear sealing element includes a glass lid.
7. A package as in claim 4 , wherein said sealing element includes a lid portion on a top of the die and a backing portion on a rear portion of the die.
8. A package as in claim 7 , wherein said indented area includes two separate sized indented areas, one sized to receive said die, and another sized to receive said backing portion.
9. A package as in claim 5 , further comprising an element which protects said sealing element against damage.
10. A package as in claim 9 , wherein said element which protects includes an extending part which extends above a top of said sealing element.
11. A package as in claim 3 , further comprising an upper portion on said package, having surfaces adapted to accept a lens therein.
12. A package as in claim 11 , wherein said surfaces include screw threads.
13. A package for an integrated circuit, comprising:
a packaging portion having a frame defining an opening between a top surface and a bottom surface, said bottom surface comprising:
a first bottom surface with an outer perimeter and an inner perimeter, said inner perimeter being disposed at an intersection of said first bottom surface with an inward facing surface, and
a second bottom surface within said inner perimeter, said first bottom surface, said inward facing surface, and said second bottom surface mutually having a metal contact thereon, said metal contact being adapted to connect to an integrated circuit disposed within said inward facing surface while preserving a portion of said opening above said integrated circuit.
14. A package as in claim 13 , further comprising an element which, in cooperation with said frame, seals said opening at the top surface, such that said package includes an open space between the element and the integrated circuit.
15. A package as in claim 14 , wherein said element which seals is transparent.
16. A package as in claim 15 , wherein said element is formed of glass, and is hermetically sealed around an area of said inner perimeter.
17. A package as in claim 16 , further comprising a backing area, hermetically sealing a bottom portion, and wherein said metal contact is disposed around said bottom portion.