IP Library Granted Patent US 7,128,474
Granted Patent B2
US 7,128,474 · App. 10/007,494 · Granted Oct 31, 2006

Optical device, enclosure and method of fabricating

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Quick Facts
Patent No.
US 7,128,474
App. No.
10/007,494
Granted
Oct 31, 2006
Kind
B2
Abstract

An enclosure for an optical communications device having a lid portion and a base portion. Alignment members adapted to interface with an optical connector are formed on the lid portion. The lid portion is affixed to the base portion with a portion of the communications components therebetween. Multiple base portions formed in a unitary piece of material and multiple lid portions formed in another unitary piece of material can be affixed to one another, and then separated into individual devices to minimize time spent aligning each base and lid portion.

Claims (25)

1. A method of fabricating an optical interconnect device, the optical interconnect device including optical-electrical components for interfacing an optical and an electrical signal, comprising:

forming at least two alignment members on a substrate;

affixing the substrate to a base material with at least a portion of the optical-electrical components therebetween; and

segmenting the affixed substrate and base material into at least two portions of affixed substrate and base material, each portion having at least one alignment member.

2. The method of claim 1 wherein forming at least two alignment members comprises depositing material in the shape of at least two alignment members.

3. The method of claim 2 further comprising using a mold to shape the deposited material.

4. The method of claim 2 wherein the material is a metal deposited in a chemical vapor deposition process.

5. The method of claim 2 wherein the material is a curable material that bonds with the substrate as it hardens.

6. The method of claim 2 further comprising the step of depositing a preliminary layer on the substrate to promote adhesion of the at least two alignment members.

7. The method of claim 2 wherein forming the at least two alignment members on the substrate comprises affixing at least two prefabricated alignment members to the substrate.

8. The method of claim 2 wherein forming the at least two alignment members on the substrate comprises affixing an overlay having at least two alignment members thereon to the substrate.

9. The method of claim 2 further comprising etching the substrate using photolithograpy techniques to form at least one recess; and

wherein the step of depositing material in the shape of at least two alignment members further comprises depositing material into the at least one recess in the shape of at least one of the at least two alignment members.

10. The method of claim 1 wherein forming at least two alignment members comprises molding the at least two alignment members together with the substrate.

11. The method of claim 1 wherein forming the at least two alignment members comprises machining the substrate to form the at least two alignment members.

12. The method of claim 1 where forming the at least two alignment members comprises etching the substrate using photolithography techniques to form the at least two alignment members.

13. A structure divisible into two or more optical communications devices, each of said two or more optical communications devices having at least one optical electrical device, and each optical communications device adapted to join with a connector of an optical cable, the structure comprising:

a first substrate divisible into at least two portions and having at least two optical electrical devices thereon;

a second substrate divisible into at least two portions and affixed to the first substrate with the at least two optical electrical devices positioned therebetween, the second substrate having at least two optical components thereon; and

at least two alignment members formed on the second substrates, each alignment member adapted to interface with the connector to align the connector in relation to the second substrate, at least one of the at least two alignment members being formed on each portion of said second substrate.

14. The structure of claim 13 , wherein at least one of the at least two alignment members is a prefabricated alignment member bonded to a portion of the second substrate.

15. The structure of claim 14 wherein at least one of the at least two alignment members is a microsphere.

16. The structure of claim 13 wherein at least one of the at least two alignment members is shaped from the second substrate.

17. The structure of claim 13 wherein at least one of the at least two alignment members is formed on an overlay and affixed to the second substrate.

18. The structure of claim 13 wherein at least a portion of the second substrate is transparent and the second substrate further comprises at least two optical devices formed in the second substrate.

Assignments (12)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0199 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2002
From: GIBONEY, KIRK S.; SIMON, JONATHAN
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 012478/0836 →