IP Library › Granted Patent US 6,608,686
Granted Patent Utility
US 6,608,686 · Confirmation No. 2035

MEASUREMENT OF METAL ELECTROPLATING AND SEED LAYER THICKNESS AND PROFILE

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 Code Description Pages PDF
2001-12-13 TRNA Transmittal of New Application 3 View
2001-12-13 ADS Application Data Sheet 2 View
2001-12-13 SPEC Specification 9 View
2001-12-13 CLM Claims 5 View
2001-12-13 ABST Abstract 1 View
2001-12-13 DRW Drawings-only black and white line drawings 9 View
2001-12-13 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,608,686
App. No.
10/022,035
Filed
2001-12-13
Granted
2003-08-19
Pub. No.
US20030151751A1
Art Unit
2877
PTA
0 days