Method and structure for manufacturing improved yield semiconductor packaged devices
View Patent ↗A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in order to alleviate thermal mismatch stress between the semiconductor die and the printed circuit board to which the packaged device is soldered, while maintaining the reliability of the packaged device itself.
1. A method for assembling a device package assembly for a semiconductor die, comprising adhering a semiconductor die having at least one conductive bond pad to a surface of a polymeric interposer having at least one conductive interconnect with a plurality of non-interconnected strips of compliant adhesive film, the strips extending substantially along a length of the die and having respective widths, a sum of the respective widths being substantially less than a width of the die; and heating the package assembly after adhering the semiconductor die to the compliant adhesive film to firmly attach the semiconductor die to the interposer prior to electrically coupling the bond pad to the conductive interconnect.
2. The method of claim 1 , further comprising injecting into regions remaining in between the semiconductor die and the interposer an encapsulating material.
3. The method of claim 1 , further comprising bonding the electrically conductive interconnect to the bond pad.
4. The method of claim 1 , further comprising coupling the electrically conductive interconnect to an external conductive terminal located on a surface of the interposer opposite of the surface on which the semiconductor die is adhered.
5. A method for assembling a device package assembly for a semiconductor die, comprising adhering a semiconductor die having at least one conductive bond pad to a surface of a polymeric interposer having at least one conductive interconnect with a plurality of non-interconnected strips of compliant adhesive film, the strips extending substantially and continuously along a length of the die and having respective widths, a sum of the respective widths being substantially less than a width of the die; and heating the package assembly after adhering the semiconductor die to the compliant adhesive film to firmly attach the semiconductor die to the interposer prior to electrically coupling the bond pad to the conductive interconnect.
6. The method of claim 5 , further comprising injecting an encapsulating material into a region between the semiconductor die and the interposer.
7. The method of claim 5 , further comprising bonding the electrically conductive interconnect to the bond pad.
8. The method of claim 5 , further comprising coupling the electrically conductive interconnect to an external conductive terminal located on a surface of the interposer opposite of the surface on which the semiconductor die is adhered.