IP Library › Granted Patent US 6,615,484
Granted Patent Utility
US 6,615,484 · Confirmation No. 3105

SOLDER FLUX COMPATIBLE WITH FLIP-CHIP UNDERFILL MATERIAL

Inventor: Kenneth J. Kirsten
Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-01-18 TRNA Transmittal of New Application 2 View
2002-01-18 A.PE Preliminary Amendment 2 View
2002-01-18 SPEC Specification 37 View
2002-01-18 CLM Claims 3 View
2002-01-18 ABST Abstract 1 View
2002-01-18 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,615,484
App. No.
10/051,661
Filed
2002-01-18
Granted
2003-09-09
Pub. No.
US20020095783A1
Art Unit
3729
PTA
-39 days