IP Library Assignment 018099/0329
Patent Assignment
Reel/Frame 018099/0329

Change of Name

Recorded: 2006-08-14 Pages: 7
Assignor
KAC HOLDING, INC.
Executed: 2006-07-06
Assignee
KESTER, INC.
515 EAST TOUHY AVENUE, DES PLAINES, ILLINOIS, 60018
Covered Properties (15)
Package for Spooled Products
Patent: 5,064,066 →
Application: 07/674,180 →
No-Clean, Low-Residue, Volatile Organic Compound Free Soldering Flux and Method of Use
Patent: 5,334,260 →
Application: 08/014,201 →
No-Clean, Low-Residue, Volatile Organic Compound Free Soldering Flux and Method of Use
Patent: 5,281,281 →
Application: 08/014,203 →
Encapsulant with Fluxing Properties and Method of Use in Flip-Chip Surface Mount Reflow Soldering
Patent: 7,041,771 →
Application: 08/644,912 →
Solder Flux Compatible with Flip-Chip Underfill Material
Patent: 6,367,150 →
Application: 09/148,506 →
Solder Flux Compatible with Flip-Chip Underfill Material
Patent: 6,615,484 →
Application: 10/051,661 →
Publication: US 2002/0095783
Method of Controlling Solder Deposition Utilizing Two Fluxes and Preform
Patent: 6,786,391 →
Application: 10/271,883 →
Publication: US 2004/0074952
Encapsulant with Fluxing Properties and Method of Use in Flip-Chip Surface Mount Reflow Soldering
Patent: 6,819,004 →
Application: 10/361,390 →
Publication: US 2003/0175521
Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
Application: 10/361,671 →
Publication: US 2003/0176599
Surface reactive preservative for use with solder preforms
Application: 10/682,669 →
Publication: US 2005/0077502
Method of controlling solder deposition on heat spreader used for semiconductor package
Application: 11/220,457 →
Publication: US 2007/0051774
Lead-free solder with low copper dissolution
Application: 11/366,523 →
Publication: US 2007/0172381
Thermoconductimetric Analyzer for Soldering Process Improvement
Patent: 7,653,511 →
Application: 11/405,647 →
Publication: US 2007/0241165
Lead-free solder with low copper dissolution
Application: 60/757,721 →
No-Clean, Low-Residue, Volatitle Organic Compound Free Soldering Flux and Method of Use
Application: 90/003,707 →
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Mar 25, 1991
From: BARNES, ROBERT E.
To: LITTON SYSTEMS, INC., A DE CORP.
Reel/Frame 005653/0989 →
Assignment of Assignors Interest. Apr 2, 1993
From: STEFANOWSKI, KRYSTYNA
To: LITTON SYSTEMS, INC.
Reel/Frame 006481/0520 →
Assignment of Assignors Interest. Apr 2, 1993
From: STEFANOWSKI, KRYSTYNA
To: LITTON SYSTEMS, INC.
Reel/Frame 006475/0689 →
Assignment of Assignor's Interest Dec 17, 2001
From: KIRSTEN, KENNETH J.
To: LITTON SYSTEMS, INC.
Reel/Frame 012369/0202 →
Assignment of Assignor's Interest Dec 26, 2001
From: KIRSTEN, KENNETH J.
To: LITTON SYSTEMS, INC.
Reel/Frame 012265/0009 →
Assignment of Assignor's Interest Jan 14, 2003
From: STIPP, JOHN N.; DERAM, BRIAN T.
To: LITTON SYSTEMS, INC.
Reel/Frame 013655/0268 →
Assignment of Assignor's Interest Oct 9, 2003
From: MUNIE, GREGORY C.
To: LITTON SYSTEMS, INC.
Reel/Frame 014595/0271 →
Assignment of Assignor's Interest Mar 12, 2004
From: LITTON SYSTEMS, INC.
To: KAC HOLDINGS, INC.
Reel/Frame 014420/0221 →
Security Interest Mar 24, 2004
From: SN INVESTORS, INC.; KAC HOLDINS, INC.
To: AMERICAN CAPITAL FINANCIAL SERVICES, INC.
Reel/Frame 014455/0486 →
Assignment of Assignor's Interest Feb 9, 2005
From: KAC HOLDINGS, INC. D/B/A KESTER, INC.
To: CIT LENDING SERVICES CORPORATION
Reel/Frame 015740/0814 →
Assignment of Assignor's Interest Dec 19, 2005
From: STIPP, JOHN N.; DERAM, BRIAN T.
To: KAC HOLDINGS, INC.
Reel/Frame 017368/0584 →
Assignment of Assignor's Interest Feb 16, 2006
From: STIPP, JOHN; DERAM, BRIAN
To: KAC HOLDINGS, INC.
Reel/Frame 017178/0515 →
Assignment of Assignor's Interest Apr 18, 2006
From: BRIAN, DERAM; CINQUINO, NICK; KLIMAH, PAUL
To: KAC HOLDINGS, INC.
Reel/Frame 017796/0896 →
Assignment of Assignor's Interest Jun 16, 2006
From: DERAM, BRIAN T.
To: KAC HOLDINGS, INC.
Reel/Frame 017799/0228 →
Change of Name Aug 14, 2006
From: KAC HOLDINGS, INC.
To: KAC HOLDING, INC.
Reel/Frame 018099/0325 →
Change of Name Jun 12, 2019
From: KESTER INC.
To: KESTER LLC
Reel/Frame 049443/0279 →
Debt Release (from Related Trademark S.A.) Oct 21, 2019
From: CIT LENDING SERVICES CORPORATION
To: KAC HOLDINGS, INC.
Reel/Frame 050783/0694 →
Debt Release (from Related Patent S.A.) Oct 21, 2019
From: AMERICAN CAPITAL FINANCIAL SERVICES, INC.
To: KAC HOLDINGS, INC.
Reel/Frame 050783/0650 →
Assignment of Assignor's Interest Mar 31, 2025
From: KESTER LLC
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 070676/0099 →