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App. No. 11/220,457 · Confirmation No. 5020

Method of controlling solder deposition on heat spreader used for semiconductor package

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2010-07-01 FWCLM Index of Claims 3 View
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2009-10-19 WFEE Fee Worksheet (SB06) 1 View
2009-07-23 CTFR Final Rejection 22 View
2009-07-23 892 List of references cited by examiner 1 View
2009-07-23 FWCLM Index of Claims 3 View
2009-07-23 SRFW Search information including classification, databases and other search related notes 1 View
2009-07-23 SRNT Examiner's search strategy and results 2 View
2009-03-23 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2009-03-23 CLM Claims 11 View
2009-03-23 REM Applicant Arguments/Remarks Made in an Amendment 4 View
2009-03-23 LET. Miscellaneous Incoming Letter 2 View
2009-03-23 XT/ Extension of Time 2 View
2009-03-23 WFEE Fee Worksheet (SB06) 1 View
2008-09-18 CTNF Non-Final Rejection 10 View
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2008-09-18 FWCLM Index of Claims 3 View
2008-09-18 SRFW Search information including classification, databases and other search related notes 1 View
2008-09-18 SRNT Examiner's search strategy and results 6 View
2008-09-18 1449 List of References cited by applicant and considered by examiner 6 View
2008-09-18 STATUS.LET Request for status of Application 1 View
2007-04-23 A.PE Preliminary Amendment 1 View
2007-04-23 SPEC Specification 9 View
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2006-09-05 LET. Miscellaneous Incoming Letter 4 View
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2005-12-19 136A Authorization for Extension of Time all replies 1 View
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2005-09-29 PEFN Pre-Exam Formalities Notice 2 View
2005-09-06 TRNA Transmittal of New Application 2 View
2005-09-06 SPEC Specification 23 View
2005-09-06 CLM Claims 9 View
2005-09-06 ABST Abstract 1 View
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2005-09-06 OATH Oath or Declaration filed 2 View
2005-09-06 WFEE Fee Worksheet (SB06) 1 View
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2005-09-06 PG.NONPUB.RQ Nonpublication request from applicant 1 View
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Quick Facts
App. No.
11/220,457
Filed
2005-09-06
Pub. No.
US20070051774A1
Art Unit
1733