Patent Assignment
Reel/Frame 017178/0515
Assignment of Assignor's Interest
Recorded: 2006-02-16
Pages: 2
Assignee
KAC HOLDINGS, INC.
515 EAST TOUHY AVENUE, DES PLAINES, ILLINOIS, 60018
Covered Property
(1)
Method of controlling solder deposition on heat spreader used for semiconductor package
Application:
11/220,457 →
Publication:
US 2007/0051774
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 19, 2005
From: STIPP, JOHN N.; DERAM, BRIAN T.
To: KAC HOLDINGS, INC.
Reel/Frame 017368/0584 →
Change of Name
Aug 14, 2006
From: KAC HOLDINGS, INC.
To: KAC HOLDING, INC.
Reel/Frame 018099/0325 →
Change of Name
Aug 14, 2006
From: KAC HOLDING, INC.
To: KESTER, INC.
Reel/Frame 018099/0329 →