IP Library › Assignment 017368/0584
Patent Assignment
Reel/Frame 017368/0584

Assignment of Assignor's Interest

Recorded: 2005-12-19 Pages: 5
Assignors
STIPP, JOHN N.
Executed: 2005-12-12
DERAM, BRIAN T.
Executed: 2005-12-12
Assignee
KAC HOLDINGS, INC.
515 E. TOUHY AVENUE, DES PLAINES, ILLINOIS, 60018
Covered Property (1)
Method of controlling solder deposition on heat spreader used for semiconductor package
Application: 11/220,457 →
Publication: US 2007/0051774
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 16, 2006
From: STIPP, JOHN; DERAM, BRIAN
To: KAC HOLDINGS, INC.
Reel/Frame 017178/0515 →
Change of Name Aug 14, 2006
From: KAC HOLDINGS, INC.
To: KAC HOLDING, INC.
Reel/Frame 018099/0325 →
Change of Name Aug 14, 2006
From: KAC HOLDING, INC.
To: KESTER, INC.
Reel/Frame 018099/0329 →