Patent Application
Provisional
Small
App. No. 60/757,721
· Confirmation No. 6076
Lead-free solder with low copper dissolution
Inventor:
Brian T. Deram
Provisional Application Expired
Inventors
Brian T. Deram
Lincolnshire, IL
Attorneys & Agents of Record
Prosecution
- Customer No.
- 52940
- Docket No.
- 094864.00000
- Confirmation No.
- 6076
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Quick Facts
- App. No.
- 60/757,721
- Filed
- 2006-01-10
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