IP Library › Granted Patent US 6,783,921
Granted Patent Utility
US 6,783,921 · Confirmation No. 5242

METHOD FOR ETCHING LAMINATED ASSEMBLY INCLUDING POLYIMIDE LAYER

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2004-03-12 IFEE Issue Fee Payment (PTO-85B) 1 View
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2004-03-09 FOR Foreign Reference 11 View
2003-12-19 LET. Miscellaneous Incoming Letter 5 View
2003-11-12 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2002-01-31 TRNA Transmittal of New Application 2 View
2002-01-31 A.PE Preliminary Amendment 6 View
2002-01-31 SPEC Specification 22 View
2002-01-31 CLM Claims 2 View
2002-01-31 ABST Abstract 1 View
2002-01-31 DRW Drawings-only black and white line drawings 2 View
2002-01-31 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,783,921
App. No.
10/059,107
Filed
2002-01-31
Granted
2004-08-31
Pub. No.
US20030054293A1
Art Unit
1756
PTA
-120 days