Apparatus for making semiconductor device
View Patent ↗A system for manufacturing a semiconductor device, comprises first and second metal molds ( 100 a, 100 b ) to form a cavity; a pair of plungers ( 102, 103 ) provided in cylinder holes ( 102 a, 103 b ) of the second metal mold ( 100 b ); a pressure supplying unit for pushing the plungers ( 102, 103 ) under a pressure lower than the injection pressure applied to the plunger ( 101 ) to form debris cavities (DC 1, DC 2 ) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.
1. An apparatus for manufacturing a semiconductor device, comprising:
a metal mold consisting of a first metal mold on which a semiconductor wafer substrate is placed, a second metal mold having a cavity, and a third metal mold; and
enclosing resin layer forming means for filling said cavity with a molten resin to form an enclosing resin layer on said semiconductor wafer substrate, said enclosing resin layer forming means including:
at least one first plunger provided in said third metal mold for filling said cavity with said molten resin under a predetermined injection pressure;
a surface of said third metal mold being opposed to said semiconductor wafer substrate on said first metal mold; and
sliding means for making either said first and second metal molds or said third metal mold slidable with respect to each other under a pressure of said molten resin filled in said cavity, said apparatus further comprising:
a first pressure application means for applying a first pressure higher than a resin pressure of said molten resin to either first and second metal molds or said third metal mold in a first direction opposite to a second direction of said resin pressure; and
a second pressure application means for applying a second pressure lower than said resin pressure in said second direction.
2. The apparatus according to claim 1 , wherein said first pressure application means comprises a piston to which a pressure higher than said resin pressure is applied.
3. The apparatus according to claim 1 , wherein said second pressure application means comprises a spring having a spring pressure lower than said resin pressure.
4. An apparatus for manufacturing a semiconductor device, comprising:
a metal mold consisting of a first metal mold on which a semiconductor wafer substrate is placed, a second metal mold having a cavity, and a third metal mold; and
enclosing resin layer forming means for filling said cavity with a molten resin to form an enclosing resin layer on said semiconductor wafer substrate, said enclosing resin layer forming means including:
at least one first plunger provided in said third metal mold for filling said cavity with said molten resin under a predetermined injection pressure;
a surface of said third metal mold being opposed to said semiconductor wafer substrate on said first metal mold; and
sliding means for making either said first and second metal molds or said third metal mold slidable with respect to each other under a pressure of said molten resin filled in said cavity, wherein said first plunger is provided at a position corresponding to a central area of said semiconductor wafer substrate.
5. A molding apparatus comprising:
a first mold having a first cavity for supporting a semiconductor wafer therein;
a second mold having a second cavity for injecting a resin therein, a first through hole connected to said second cavity at a central position of said cavity and a second through hole connected to said second cavity at a peripheral position of said second cavity;
a first plunger provided within said first hole for injecting said resin;
a second plunger provided within said second through hole for absorbing said resin overflowed from said second cavity; and
a plunger unit connected to said first and second plungers, said plunger unit supplying a first pressure to said first plunger and a second pressure, which is smaller than said first pressure, to said second plunger by a single gauge pressure.
6. The molding apparatus according to claim 5 , wherein said plunger unit has a first piston for providing said first pressure to said first plunger and a second piston for providing said second pressure to said second plunger.
7. The molding apparatus according to claim 5 , wherein said first plunger has a first bore diameter and said second plunger has a second bore diameter which is larger than said first bore diameter.
8. The molding apparatus according to claim 5 , wherein a tablet is placed on said first plunger.
9. The molding apparatus according to claim 5 , wherein said first and second through holes are cylindrical holes.