Patent Assignment
Reel/Frame 022052/0540
Change of Name
Recorded: 2008-12-11
Received: 2008-12-31
Pages: 16
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Properties
(100)
Method of Manufacturing Semiconductor Device
Application:
12/183,287 →
Micro-Controller Having Usb Control Unit, Mc Unit and Oscillating Circuit Commonly Used by the Usb Control Unit and the Mc Unit
Application:
12/213,772 →
Semiconductor Device Including Analog Voltage Output Driver Lsi Chip Having Test Circuit
Application:
12/153,950 →
Forming Method of Silicide Film
Application:
11/642,894 →
Semiconductor Device That Suppresses Variations in High Frequency Characteristics of Circuit Elements
Application:
11/528,335 →
Method of Mounting an Electronic Component
Application:
11/481,181 →
Method of Manufacturing Wiring Substrate Having Terminated Buses
Application:
11/440,113 →
Semiconductor Device Which Prevents Light from Entering Therein
Application:
11/346,231 →
Method for Forming Semiconductor Device
Application:
11/311,365 →
Semiconductor Memory Device Having Full Depletion Type Logic Transistors and Partial Depletion Type Memory Transistors
Application:
11/271,980 →
Data communication system, connector cable and communication adapter medium used in the data communication system
Application:
11/228,198 →
Optical Member with Handling Portion and Method for Manufacturing Optical Member and Method for Mounting Optical Member and Optical Module
Application:
11/227,088 →
Semiconductor Device
Application:
11/222,911 →
Method of Manufacturing Semiconductor Device
Application:
11/221,832 →
Method of Producing Semiconductor Element and Nonvolatile Semiconductor Memory Produced by This Method
Application:
11/202,190 →
Process for Making Light Waveguide Element
Application:
11/196,271 →
Micro-Controller Having Usb Control Unit, Mc Unit and Oscillating Circuit Commonly Used by the Usb Control Unit and the Mc Unit
Application:
11/154,718 →
Lift-Off Method and Chemical Liquid Tank
Application:
11/111,860 →
Semiconductor Device and Manufacturing Method Thereof
Application:
11/091,529 →
Semiconductor Device and Method of Manufacturing the Same
Application:
11/068,452 →
Wiring Layer Structure for Ferroelectric Capacitor
Application:
11/065,582 →
A Waveguide Type Optical Element
Application:
11/063,832 →
Controlling Method for Manufacturing Process Comprising Determining a Priority of Manufacturing Process Recovery in Response to Degree of Risk
Application:
11/061,813 →
Saw Device
Application:
11/041,198 →
Inspection Pattern, Inspection Method, and Inspection System for Detection of Latent Defect of Multi-Layer Wiring Structure
Application:
11/037,131 →
Drive Circuit for Driving a Current-Driven Display Unit
Application:
11/034,921 →
Semiconductor Integrated Circuit
Application:
11/029,509 →
Semiconductor Integrated Circuit
Application:
11/029,486 →
Semiconductor Integrated Circuit
Application:
11/029,485 →
Internal Step-Down Power Supply Circuit
Application:
11/028,065 →
Method of Forming Reduced Short Channel Field Effect Transistor
Application:
11/026,231 →
Apparatus and Method for Storing an Electronic Component, Method for Packaging Electronic Components and Method for Mounting an Electronic Component
Application:
11/016,401 →
Transmitting Filter Including Saw Resonators
Application:
10/983,788 →
Semiconductor Memory Device Having Full Depletive Type Logic Transistors and Partial Depletion Type Memory Transistors
Application:
10/969,906 →
Memory Control Circuit
Application:
10/964,632 →
Semiconductor Device Having Pll-Circuit
Application:
10/941,996 →
Semiconductor Device and Semiconductor Device Manufacturing Method
Application:
10/929,373 →
Forming Method of Silicide Film
Application:
10/900,278 →
Microlens, Its Forming Method and Optical Module
Application:
10/892,449 →
Method and Circuit for Reading Data from a Ferroelectric Memory Cell
Application:
10/882,687 →
Optical Member with Handling Portion and Method for Manufacturing Optical Member and Method for Mounting Optical Member and Optical Module
Application:
10/854,339 →
Soft-Output Decoder with Computation Decision Unit
Application:
10/852,654 →
Internal Step-Down Power Supply Circuit
Application:
10/845,215 →
Semiconductor device having multilayered conductive layers
Application:
10/834,126 →
Semiconductor Device Having a Tapered Interconnection with Insulating Material on Conductive Sidewall Thereof Within Through Hole
Application:
10/832,229 →
Semiconductor Package and Method of Fabricating Same
Application:
10/810,600 →
Method of calling up target call receiver and communications terminal equipment used for implementing same
Application:
10/809,694 →
Analog to Digital Converter Selecting Reference Voltages in Accordance with Feedback from Prior Stages
Application:
10/788,290 →
Method for Fabricating a Semiconductor Device Having a Metallic Silicide Layer
Application:
10/780,867 →
Memory Test Circuit with Data Expander
Application:
10/769,864 →
Drive Circuit for Driving a Current-Driven Display Unit
Application:
10/762,351 →
Output Buffer Circuit
Application:
10/752,010 →
Voltage Regulator Combining a Series Type Regulator with a Shunt Type Regulator Having a Constant Current Source
Application:
10/748,198 →
Semiconductor Device Having Ppl-Circuit
Application:
10/748,205 →
Optical Member with Handling Portion and Method for Manufacturing Optical Member and Method for Mounting Optical Member and Optical Module
Application:
10/724,625 →
Modulator
Application:
10/724,117 →
Demodulating Circuit and Optical Receiving Circuit
Application:
10/721,550 →
Method of Manufacturing Semiconductor Chip Having Supporting Member
Application:
10/717,655 →
Tape Carrier Package Having Stacked Semiconductor Elements, and Short and Long Leads
Application:
10/699,706 →
Semiconductor Memory Device
Application:
10/675,829 →
Interrupt Program Module
Application:
10/654,442 →
Semiconductor Memory Device
Application:
10/648,372 →
Method of Fabricating Semiconductor Device
Application:
10/630,770 →
Method of Manufacturing Semiconductor Device Having Thin Film Soi Structure
Application:
10/625,544 →
Digital-To-Analog Converting Circuit
Application:
10/625,902 →
Data Processing Apparatus Configured to Operate with One of More Clock Frequencies Determined by a Priority Order Derived from One or More Interrupt Signals from a Cpu
Application:
10/623,718 →
Failure Analysis System and Failure Analysis Method of Logic Lsi
Application:
10/621,603 →
Capacity Measuring Device and Capacity Measuring Method
Application:
10/609,408 →
Error Correcting Device and Method Thereof That Turbo-Decodes Only If an Error Is Detected in the Received Data
Application:
10/460,212 →
Control Circuit for Supplying a Current to Display Devices
Application:
10/456,752 →
Method for Forming Semiconductor Device
Application:
10/445,859 →
Method of Forming Metal Wiring
Application:
10/444,986 →
Apparatus and Method for Storing an Electronic Component, Method for Packaging Electronic Components and Method for Mounting an Electronic Component
Application:
10/442,977 →
Power Circuit
Application:
10/434,221 →
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
Application:
10/419,114 →
Semiconductor device and method for manufacturing the same
Application:
10/418,210 →
Semiconductor Device and Manufacturing Method Thereof
Application:
10/414,721 →
Optical Semiconductor Device and Method of Fabricating the Same
Application:
10/411,216 →
Boundary Scan Circuit
Application:
10/405,489 →
Voltage Regulator Circuit and Integrated Circuit Device Including the Same
Application:
10/401,742 →
Processor and Instruction Execution Method with Reduced Address Information
Application:
10/395,849 →
Cr Oscillation Circuit
Application:
10/392,820 →
Automatic Frequency Control Apparatus for Determining Loop Gain Constant Based on Absolute Phase Error
Application:
10/373,081 →
Saw Filter with an Improved Attenuation Characteristic at a Frequency Any Multiple of an Attenuation Pole Frequency at One or Both Sides of a Pass Band
Application:
10/369,501 →
Computation Circuit Having Dynamic Range Extension Function
Application:
10/367,691 →
Method for Preventing Electrode Deterioration in Etching Apparatus
Application:
10/361,823 →
Method of Forming Semiconductor Device with Bipolar Transistor Having Lateral Structure
Application:
10/352,873 →
Method of Fabricating a Semiconductor Device with a Gold Conductive Layer and Organic Insulating Layer
Application:
10/353,028 →
Power on Reset Circuit
Application:
10/352,229 →
Method of Forming Electrode for Saw Device
Application:
10/351,554 →
Circuit Structure and Semiconductor Integrated Circuit
Application:
10/348,896 →
Flexible Tube for Vacuum System
Application:
10/345,317 →
Semiconductor device with chip-on-film package having insulating film that resists edge shorts
Application:
10/345,319 →
Output Buffer Circuit
Application:
10/342,239 →
Soi Mos Field Effect Transistor and Manufacturing Method Therefor
Application:
10/342,191 →
Semiconductor Device and Manufacturing Method Thereof
Application:
10/341,463 →
Field Effect Transistor
Application:
10/339,455 →
Method of Fabricating a Semiconductor Device
Application:
10/339,454 →
Analog Summing and Differencing Circuit, Optical Receiving Circuit, Optical Transmitting Circuit, Automatic Gain Control Amplifier, Automatic Frequency Compensation Amplifier, and Limiting Amplifier
Application:
10/339,457 →
Image Noise Reduction Circuit
Application:
10/338,759 →