IP Library Granted Patent US 6,908,562
Granted Patent B2
US 6,908,562 · App. 10/351,554 · Granted Jun 21, 2005

Method of forming electrode for saw device

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Quick Facts
Patent No.
US 6,908,562
App. No.
10/351,554
Granted
Jun 21, 2005
Kind
B2
Abstract

A method of forming an electrode for a surface acoustic wave (SAW) device comprises the steps of forming an alloy film ( 32 ) made of aluminum (Al) and magnesium (Mg) on a substrate ( 31 ) and selectively etching the alloy film ( 32 ) by using a gaseous mixture composed of BCl 3 , Cl 2 , and N2 to form the electrode such that the electrode has at least one sidewall polymer film ( 33 ). The method controls the production of hillocks and voids to provide high withstand voltage.

Claims (12)

1. A method of forming an SAW electrode for a surface acoustic wave (SAW) device, comprising the steps of:

providing a substrate;

selecting, as a material of said SAW electrode, an alloy made of aluminum (Al) and magnesium (Mg) to form an alloy film on said substrate; and

selectively etching said alloy film to form said SAW electrode such that said SAW electrode has at least one sidewall film.

2. The method according to claim 1 , wherein said etching is performed with a gaseous mixture composed of Bl3, Cl2, and N2.

3. The method according to claim 1 , wherein said alloy film contains 1-10 weight percent of Mg.

4. The method according to claim 1 , which further comprises the step of forming a film of chromium (Cr) on said substrate before the step of forming said alloy film so that said alloy film is formed on said Cr film.

5. The method according to claim 4 , wherein said Cr film is selectively etched by using said alloy film as a mask.

6. The method according to claim 4 , wherein said Cr and alloy films are alternately formed a plurality of times.

7. The method according to claim 1 , wherein said etching is performed by applying a high-frequency voltage.

8. The method according to claim 1 , wherein a content of Mg in said alloy film is changed so that said electrode has a different shape.

9. The method according to claim 2 , wherein said N 2 gas contained in said gaseous mixture has a throughput of 5-10 sccm.

Assignments (5)
MERGER Recorded Jan 25, 2016
From: INTELLECTUAL VENTURES FUND 77 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037577/0581 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2012
From: LAPIS SEMICONDUCTOR CO., LTD.
To: INTELLECTUAL VENTURES FUND 77 LLC
Reel/Frame 028093/0534 →
CHANGE OF NAME Recorded Jan 31, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027622/0360 →
CHANGE OF NAME Recorded Dec 11, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2003
From: HAKAMADA, SHINICHI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 013709/0868 →