Method of mounting an electronic component
An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.
1. method for mounting an electronic component having a first surface and an opposite second surface on a substrate, comprising:
preparing an apparatus for storing the electronic component, wherein the apparatus comprises
a first film having a pocket that stores the electronic component, and wherein the pocket has a protrusion at a bottom, and wherein a top of the protrusion contacts with the second surface of the electronic component, and
a second film covering the pocket, and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference, so that the electronic component does not move freely;
peeling away the second film from the apparatus;
extracting the electronic component from the pocket; and
mounting the extracted electronic component on the substrate.
2. The method according to claim 1 , wherein said first and second films are made of an organic substance.
3. A method for mounting an electronic component having a first surface and an opposite second surface on a substrate, comprising:
preparing an apparatus for storing the electronic component, wherein the apparatus comprises
a first film having a pocket that stores the electronic component, and wherein the pocket has a protrusion at a bottom, and wherein a top of the protrusion contacts with the second surface of the electronic component and wherein the bottom of the pocket has a through hole, and
a second film covering the pocket, and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely, and
a third film covering the through hole;
peeling away the third film from the apparatus;
peeling away the second film from the apparatus;
extracting the electronic component from the pocket; and
mounting the extracted electronic component on the substrate.
4. The method according to claim 3 , wherein said first and second films are made of an organic substance.
5. A method for mounting an electronic component having a first surface and an opposite second surface on a substrate, comprising:
preparing an apparatus for storing the electronic component, wherein the apparatus comprises
a first film having a pocket that stores the electronic component, and wherein the pocket has a protrusion at a bottom, and wherein a top of the protrusion contacts with the second surface of the electronic component,
a second film covering the pocket, and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely, and
a third film covering the second film;
peeling away the second and third films from the apparatus;
extracting the electronic component from the pocket; and
mounting the extracted electronic component on the substrate.
6. The method according to claim 5 , wherein said first and second films are made of an organic substance.
7. A method for mounting an electronic component having a first surface and an opposite second surface on a substrate, comprising:
preparing an apparatus for storing the electronic component, wherein the apparatus comprises
a first film having a front surface and a back surface opposite the front surface, and having a pocket that stores the electronic component on the front surface, and wherein the front surface of the first film protrudes from a bottom of the pocket to provide a protrusion within the pocket and a hollow along the back surface of the first film under the protrusion, and wherein a top of the protrusion contacts with the second surface of the electronic component, and
a second film covering the pocket, and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference, so that the electronic component does not move freely;
peeling away the second film from the apparatus;
extracting the electronic component from the pocket; and
mounting the extracted electronic component on the substrate.
8. The apparatus according to claim 7 , wherein said first and second films are made of an organic substance.