IP Library Granted Patent US 6,514,130
Granted Patent Utility
US 6,514,130 · Confirmation No. 6924

METHOD AND APPARATUS FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC SUBSTRATES

Inventor: Scott E. Moore
⬇ PDF
Code Description Pages PDF
2002-03-12 TRNA Transmittal of New Application 3 View
2002-03-12 ADS Application Data Sheet 2 View
2002-03-12 A.PE Preliminary Amendment 2 View
2002-03-12 SPEC Specification 14 View
2002-03-12 CLM Claims 17 View
2002-03-12 ABST Abstract 1 View
2002-03-12 DRW Drawings-only black and white line drawings 6 View
2002-03-12 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,514,130
App. No.
10/096,540
Filed
2002-03-12
Granted
2003-02-04
Pub. No.
US20020094765A1
Art Unit
3723
PTA
-60 days